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Studies on the reliability of power packages based on strength and fracture criteria., , , and . Microelectron. Reliab., 52 (7): 1255-1265 (2012)Comparative characterization of chip to epoxy interfaces by molecular modeling and contact angle determination., , , , and . Microelectron. Reliab., 52 (7): 1285-1290 (2012)Mechanical Reliability of MEMS-structures under shock load., , , , , , and . Microelectron. Reliab., 41 (9-10): 1657-1662 (2001)Simulation based analysis of secondary effects on solder fatigue., , , and . Microelectron. Reliab., 49 (8): 839-845 (2009)Progress in reliability research in the micro and nano region., and . Microelectron. Reliab., 46 (9-11): 1685-1694 (2006)Reliability of SnPb and Pb-free flip-chips under different test conditions., , , , and . Microelectron. Reliab., 47 (2-3): 252-258 (2007)Molecular dynamics approach to structure-property correlation in epoxy resins for thermo-mechanical lifetime modeling., , , , , , , , , and . Microelectron. Reliab., 50 (7): 900-909 (2010)Basic thermo-mechanical property estimation of a 3D-crosslinked epoxy/SiO2 interface using molecular modelling., , , , and . Microelectron. Reliab., 51 (6): 1027-1034 (2011)Stress impact of moisture diffusion measured with the stress chip., , , , , , , , and . Microelectron. Reliab., 54 (6-7): 1243-1252 (2014)On the crack and delamination risk optimization of a Si-interposer for LED packaging., , , , , and . Microelectron. Reliab., 54 (6-7): 1223-1227 (2014)