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Simulation-enabled development lot journey smoothening in a fully-utilised semiconductor manufacturing line.

W. Scholl, M. Forster, P. Preuss, A. Naumann, B. Gan, и P. Lendermann. Winter Simulation Conference, стр. 2559-2567. IEEE, (2016)

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Ernst-Christian André

Helmut André

Achim André

Karl Wilhelm Andrée

Emil Andrée

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Bereit für die Digitalisierung der Energiewende: Praxistests zur Anbindung intelligenter Messsysteme bei der 50Hertz.M. Richter, A. Naumann, R. Schülke, R. Rottmann, и T. Raak. Autom., 68 (9): 781-789 (2020)Enhancement of simulation-based semiconductor manufacturing forecast quality through hybrid tool down time modeling.P. Preuss, A. Naumann, W. Scholl, B. Gan, и P. Lendermann. WSC, стр. 2444-2453. IEEE/ACM, (2014)Operator Resource modelling in a Multiple wafer Sizes fabrication Environment using discrete Event simulation.G. Seidel, P. Preuss, A. Naumann, S. Low, C. Chan, и B. Gan. WSC, стр. 3651-3659. IEEE, (2018)Modeling and investigation of communication and protection scenarios for Smart Grid.I. Bielchev, A. Naumann, A. Visyashchev, R. Krebs, и Z. Styczynski. ISGT Europe, стр. 1-5. IEEE, (2012)Harmonizing operations management of key stakeholders in wafer fab using discrete event simulation.G. Seidel, C. Lee, A. Kam, B. Gan, C. Chan, A. Naumann, и P. Preuss. WSC, стр. 3670-3678. IEEE, (2017)Communication Infrastructure for Dynamic Grid Control Center with a Hardware-in-the-Loop Model.E. Glende, P. Trojan, I. Hauer, A. Naumann, C. Brosinsky, M. Wolter, и D. Westermann. ISGT Europe, стр. 1-6. IEEE, (2018)Bridging the Gap between fab simulation and supply Chain Forecast.W. Scholl, M. Forster, P. Preuss, A. Naumann, H. Ooi, и B. Gan. WSC, стр. 3461-3469. IEEE, (2018)Communication interface requirements during critical situations in a Smart Grid.I. Hauer, A. Naumann, M. Stötzer, и Z. Styczynski. ISGT Europe, стр. 1-7. IEEE, (2012)Attacking dynamic power system control centers - a cyber-physical threat analysis.A. Kummerow, D. Rösch, S. Nicolai, C. Brosinsky, D. Westermann, и A. Naumann. ISGT, стр. 1-5. IEEE, (2021)

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