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Bandgap engineering of two-dimensional semiconductor materials, , , , , , , , , и 11 other автор(ы). NPJ 2D MATERIALS AND APPLICATIONS, (2020)Modeling of Leakage-Assist-Switching in Ferroelectric/Dielectric Stack., , и . DRC, стр. 93-95. IEEE, (2019)First Demonstration of BEOL-Compatible Atomic-Layer-Deposited InGaZnO TFTs with 1.5 nm Channel Thickness and 60 nm Channel Length Achieving ON/OFF Ratio Exceeding 1011, SS of 68 mV/dec, Normal-off Operation and High Positive Gate Bias Stability., , , , , , , , и . VLSI Technology and Circuits, стр. 1-2. IEEE, (2023)Ultrathin Atomic-Layer-Deposited In2O3 Radio-Frequency Transistors with Record High fT of 36 GHz and BEOL Compatibility., , , , , и . VLSI Technology and Circuits, стр. 1-2. IEEE, (2023)FeFET-Based Synaptic Cross-Bar Arrays for Deep Neural Networks: Impact of Ferroelectric Thickness on Device-Circuit Non-Idealities and System Accuracy., , , , , , , , и . DRC, стр. 1-2. IEEE, (2023)Alleviation of Short Channel Effects in Ge Negative Capacitance pFinFETs., , и . DRC, стр. 1-2. IEEE, (2018)Characterization and reliability of III-V gate-all-around MOSFETs., , , , , , и . IRPS, стр. 4. IEEE, (2015)Steep-Slope Hysteresis-Free Negative-Capacitance 2D Transistors.. DRC, стр. 1. IEEE, (2018)Record RF Performance of Ultra-thin Indium Oxide Transistors with Buried-gate Structure., , , , , и . DRC, стр. 1-2. IEEE, (2022)High-Performance Few-Layer Tellurium CMOS Devices Enabled by Atomic Layer Deposited Dielectric Doping Technique., , , , , и . DRC, стр. 1-2. IEEE, (2018)