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Morpack Cube: A portable 3D heterogeneous system integration platform.

C. Chiu, C. Lin, C. Yang, Y. Liu, S. Chen, J. Chue, C. Kuo, G. Sung, C. Lin, C. Wu, and C. Huang. SoCC, page 197-202. IEEE, (2013)

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Suo-Pin Lin

Chang-Pin Lin

Mei-Chun Lin

Tzu-Chun Lin

Lin Lin

Other publications of authors with the same name

A novel design methodology for hybrid process 3D-IC.C. Huang, N. Chang, C. Chen, C. Lin, C. Wu, and C. Huang. VLSI-DAT, page 1-4. IEEE, (2012)Morpack Cube: A portable 3D heterogeneous system integration platform.C. Chiu, C. Lin, C. Yang, Y. Liu, S. Chen, J. Chue, C. Kuo, G. Sung, C. Lin, C. Wu and 1 other author(s). SoCC, page 197-202. IEEE, (2013)A 975-mW Fully Integrated Genetic Variant Discovery System-on-Chip in 28 nm for Next-Generation Sequencing.Y. Wu, Y. Chen, C. Yang, C. Lee, C. Yu, N. Chang, L. Chen, J. Chang, C. Lin, H. Chen and 3 other author(s). IEEE J. Solid State Circuits, 56 (1): 123-135 (2021)Universal CMOS Diamond-Graph Circuit for Embedded Computing.S. Cheng, C. Lin, C. Chen, and W. Tsai. SoCC, page 206-212. IEEE, (2018)A 28-nm 25.1 TOPS/W Sparsity-Aware CNN-GCN Deep Learning SoC for Mobile Augmented Reality.W. Huang, I. Lin, W. Chen, L. Lin, N. Chang, C. Lin, C. Chen, and C. Yang. VLSI Technology and Circuits, page 42-43. IEEE, (2022)A 1.625 TOPS/W SOC for Deep CNN Training and Inference in 28nm CMOS.Y. Liu, C. Kung, M. Hsieh, H. Wang, C. Lin, C. Yu, C. Chen, and T. Chiueh. ESSCIRC, page 107-110. IEEE, (2021)The design and implementation of DCT/IDCT chip with novel architecture.K. Cheng, C. Huang, and C. Lin. ISCAS, page 741-744. IEEE, (2000)A 28nm 11.2TOPS/W Hardware-Utilization-Aware Neural-Network Accelerator with Dynamic Dataflow.C. Du, C. Tsai, W. Chen, L. Lin, N. Chang, C. Lin, C. Chen, and C. Yang. ISSCC, page 332-333. IEEE, (2023)A Fully Integrated End-to-End Genome Analysis Accelerator for Next-Generation Sequencing.Y. Chen, C. Yang, Y. Wu, C. Lee, W. Chen, L. Lin, N. Chang, C. Lin, C. Chen, J. Hung and 1 other author(s). ISSCC, page 44-45. IEEE, (2023)An implantable 128-channel wireless neural-sensing microsystem using TSV-embedded dissolvable μ-needle array and flexible interposer.P. Huang, Y. Huang, S. Wu, Y. Hu, M. Lu, T. Sheng, F. Chang, C. Lin, N. Chang, H. Chen and 7 other author(s). ISCAS, page 1-4. IEEE, (2017)

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Disambiguation of "Lin, Chun-Pin"

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Morpack Cube: A portable 3D heterogeneous system integration platform.

Please choose a person to relate this publication to

Suo-Pin Lin

Chang-Pin Lin

Mei-Chun Lin

Tzu-Chun Lin

Lin Lin

Other publications of authors with the same name

Disambiguation

BibSonomy

Disambiguation of "Lin, Chun-Pin"

copydeleteadd this publication to your clipboardcommunity posthistory of this postURLDOIBibTeXEndNoteAPAChicagoDIN 1505HarvardMSOffice XML Morpack Cube: A portable 3D heterogeneous system integration platform.

Please choose a person to relate this publication to

Suo-Pin Lin

Chang-Pin Lin

Mei-Chun Lin

Tzu-Chun Lin

Lin Lin

Other publications of authors with the same name

Disambiguation

copy delete add this publication to your clipboard
community post
history of this post
URL
DOI
BibTeX
EndNote
APA
Chicago
DIN 1505
Harvard
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Morpack Cube: A portable 3D heterogeneous system integration platform.