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Highly conformal and adhesive electroless barrier and Cu seed formation using nanoparticle catalyst for realizing a high aspect ratio cu-filled TSV., , , , and . 3DIC, page 1-4. IEEE, (2013)Automatic Viewpoint Switching for Multi-view Surgical Videos., , , , and . ISMAR Adjunct, page 89-90. IEEE, (2019)Surgery Recording without Occlusions by Multi-view Surgical Videos., , , , , and . VISIGRAPP (5: VISAPP), page 837-844. SCITEPRESS, (2020)All-wet fabrication technology for high aspect ratio TSV using electroless barrier and seed layers., , , , , , and . 3DIC, page 1-5. IEEE, (2010)Toward Automatic Tuning of Tendon-driven Mechanisms: Vibration based Detection of Tendon Tension., , , , , and . ISR, page 389-394. IEEE, (2018)Cu Diffusion Barrier Properties of Various CoWB Electroless Plated Films on SiO2/Si Substrate for Via-last TSV Application., , , , , and . 3DIC, page 1-4. IEEE, (2019)Development of a Person Search Components Based on an Omnidirectional Camera and a 3D-LiDAR., , , , and . SICE, page 478-483. IEEE, (2020)Deep Selection: A Fully Supervised Camera Selection Network for Surgery Recordings., , , , and . MICCAI (3), volume 12263 of Lecture Notes in Computer Science, page 419-428. Springer, (2020)Low temperature through-Si via fabrication using electroless deposition., , , , , , , , , and 3 other author(s). 3DIC, page 1-4. IEEE, (2011)All-wet TSV filling with highly adhesive displacement plated Cu seed layer., , , , and . 3DIC, page TS8.4.1-TS8.4.3. IEEE, (2015)