Author of the publication

Applications of finite element methods for reliability study of ULSI interconnections.

, , and . Microelectron. Reliab., 52 (8): 1539-1545 (2012)

Please choose a person to relate this publication to

To differ between persons with the same name, the academic degree and the title of an important publication will be displayed. You can also use the button next to the name to display some publications already assigned to the person.

 

Other publications of authors with the same name

Damage threshold determination and non-destructive identification of possible failure sites in PIN limiter., and . Microelectron. Reliab., 54 (5): 960-964 (2014)Determination of the dice forward I-V characteristics of a power diode from a packaged device and its applications., , , , and . Microelectron. Reliab., 45 (1): 179-184 (2005)Effect of IC layout on the reliability of CMOS amplifiers., and . Microelectron. Reliab., 52 (8): 1575-1580 (2012)Electromigration reliability of interconnections in RF low noise amplifier circuit., and . Microelectron. Reliab., 52 (2): 446-454 (2012)Applications of finite element methods for reliability study of ULSI interconnections., , and . Microelectron. Reliab., 52 (8): 1539-1545 (2012)Editorial., , , , and . Microelectron. Reliab., (2016)Finite element modeling of capacitive coupling voltage contrast., , and . Microelectron. Reliab., 47 (9-11): 1555-1560 (2007)Effect of resistor tolerance on the performance of resistor network - An application of the statistical design of experiment., and . Int. J. Circuit Theory Appl., 50 (1): 175-182 (2022)Addressing the challenges in solder resistance measurement for electromigration test., , and . Microelectron. Reliab., 50 (9-11): 1352-1354 (2010)Experimental investigation on the impact of stress free temperature on the electromigration performance of copper dual damascene submicron interconnect., and . Microelectron. Reliab., 46 (9-11): 1652-1656 (2006)