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Efficient probing schemes for fine-pitch pads of InFO wafer-level chip-scale package.

Y. Huang, B. Lin, C. Wu, M. Lee, H. Chen, H. Lin, C. Peng, and M. Wang. DAC, page 58:1-58:6. ACM, (2016)

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Xavier Lee Lee

Bongsoo Lee

The role of negative regulators in coordination of the Myxococcus xanthus developmental programB. Lee. Uni Marburg, (2009)

Min-Hi Lee

Induction and regulation of antiviral defence mechanisms through intracytoplasmic sensorsM. Lee. HU Berlin, (2009)

Clara Lee

Viktor Lee

Other publications of authors with the same name

Test Cost Reduction Methodology for InFO Wafer-Level Chip-Scale Package.K. Wang, B. Lin, C. Wu, M. Lee, H. Chen, H. Lin, C. Peng, and M. Wang. IEEE Des. Test, 34 (3): 50-58 (2017)Efficient probing schemes for fine-pitch pads of InFO wafer-level chip-scale package.Y. Huang, B. Lin, C. Wu, M. Lee, H. Chen, H. Lin, C. Peng, and M. Wang. DAC, page 58:1-58:6. ACM, (2016)A novel DFT architecture for 3DIC test, diagnosis and repair.M. Lee, S. Adham, M. Wang, C. Peng, H. Lin, S. Hsu, and H. Chen. VLSI-DAT, page 1-4. IEEE, (2014)A Deep Learning-Based Screening Method for Improving the Quality and Reliability of Integrated Passive Devices.C. Chuang, K. Hou, C. Wu, M. Lee, C. Tsai, H. Chen, and M. Wang. ITC-Asia, page 13-18. IEEE, (2020)A Memory Built-In Self-Repair Scheme Based on Configurable Spares.M. Lee, L. Denq, and C. Wu. IEEE Trans. Comput. Aided Des. Integr. Circuits Syst., 30 (6): 919-929 (2011)Cost modeling and analysis for interposer-based three-dimensional IC.Y. Chou, P. Chen, M. Lee, and C. Wu. VTS, page 108-113. IEEE Computer Society, (2012)A Memory Failure Pattern Analyzer for memory diagnosis and repair.B. Lin, M. Lee, and C. Wu. VTS, page 234-239. IEEE Computer Society, (2012)A memory yield improvement scheme combining built-in self-repair and error correction codes.T. Wu, P. Chen, M. Lee, B. Lin, C. Wu, C. Tien, H. Lin, H. Chen, C. Peng, and M. Wang. ITC, page 1-9. IEEE Computer Society, (2012)High Quality Test Methodology for Highly Reliable Devices.H. Chen, M. Lee, L. Chen, and M. Wang. ITC, page 1-6. IEEE, (2019)A Memory Built-In Peer-Repair Architecture for Mesh-Connected Processor Array.P. Tan, C. Tung, C. Wu, M. Lee, and G. Liao. VLSI-DAT, page 1-4. IEEE, (2022)

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Disambiguation of "Lee, Mincent"

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Efficient probing schemes for fine-pitch pads of InFO wafer-level chip-scale package.

Please choose a person to relate this publication to

Xavier Lee Lee

Bongsoo Lee

Min-Hi Lee

Clara Lee

Viktor Lee

Other publications of authors with the same name

Disambiguation

BibSonomy

Disambiguation of "Lee, Mincent"

copydeleteadd this publication to your clipboardcommunity posthistory of this postURLDOIBibTeXEndNoteAPAChicagoDIN 1505HarvardMSOffice XML Efficient probing schemes for fine-pitch pads of InFO wafer-level chip-scale package.

Please choose a person to relate this publication to

Xavier Lee Lee

Bongsoo Lee

Min-Hi Lee

Clara Lee

Viktor Lee

Other publications of authors with the same name

Disambiguation

copy delete add this publication to your clipboard
community post
history of this post
URL
DOI
BibTeX
EndNote
APA
Chicago
DIN 1505
Harvard
MSOffice XML

Efficient probing schemes for fine-pitch pads of InFO wafer-level chip-scale package.