Author of the publication

Imitation of second language sounds in relation to L2 perception and production.

, and . J. Phonetics, (2016)

Please choose a person to relate this publication to

To differ between persons with the same name, the academic degree and the title of an important publication will be displayed. You can also use the button next to the name to display some publications already assigned to the person.

 

Other publications of authors with the same name

Evidence for featural units in the acquisition of speech production skills: Linguistic structure in foreign accent., , and . J. Phonetics, 37 (4): 357-373 (2009)Comparing L1's effects on English coda obstruent perception: Mandarin and Korean identification performance., and . ICPhS, University of Glasgow, (2015)Timing Aware Wrapper Cells Reduction for Pre-bond Testing in 3D-ICs., , , and . SoCC, page 236-241. IEEE, (2019)Again-VC: A One-Shot Voice Conversion Using Activation Guidance and Adaptive Instance Normalization., , , and . ICASSP, page 5954-5958. IEEE, (2021)A novel cache-utilization based dynamic voltage frequency scaling (DVFS) mechanism for reliability enhancements., , , , and . DATE, page 79-84. IEEE, (2016)Attitudes towards Knowledge Transfer in the Context of Web Problem-Based Learning Integrated Circuits Course From the Perspective of High School Students., , , , and . ICALT, page 709-710. IEEE Computer Society, (2009)VQVC+: One-Shot Voice Conversion by Vector Quantization and U-Net Architecture., , and . INTERSPEECH, page 4691-4695. ISCA, (2020)Architectural evaluations on TSV redundancy for reliability enhancement., , , and . DATE, page 566-571. IEEE, (2017)Dual-addressing memory architecture for two-dimensional memory access patterns., and . DATE, page 71-76. EDA Consortium San Jose, CA, USA / ACM DL, (2013)Crosstalk-aware TSV-buffer Insertion in 3D IC., , , , and . SoCC, page 400-405. IEEE, (2019)