Author of the publication

Investigations of silicon wafer bonding using thin Al and Sn films for heterogeneous integration.

, , , , , , , , , , , and . NEMS, page 155-158. IEEE, (2013)

Please choose a person to relate this publication to

To differ between persons with the same name, the academic degree and the title of an important publication will be displayed. You can also use the button next to the name to display some publications already assigned to the person.

 

Other publications of authors with the same name

An Enhancement of Crosstalk Avoidance Code Based on Fibonacci Numeral System for Through Silicon Vias., , , , and . IEEE Trans. Very Large Scale Integr. Syst., 25 (5): 1601-1610 (2017)On Continuous Speech Recognition of Indian English., , , and . ACAI, page 74:1-74:6. ACM, (2018)Design of EMI and suppression structure based on bar-via., and . Microelectron. J., (2021)A physics-based modeling method of THz Schottky diode for circuit simulation., , and . Microelectron. J., (2023)Research on deep RIE-based through-Si-via micromachining for 3-D system-in-package integration., , , , , , and . NEMS, page 90-93. IEEE Computer Society, (2009)In-line testing of blind TSVs for 3D IC integration and M/NEMS packaging., , , , , and . NEMS, page 233-236. IEEE, (2013)A LTCC microsystem vacuum package substrate with embedded cooling microchannel and Pirani gauge., , , , , and . NEMS, page 399-403. IEEE, (2010)TSV Defects Classification with Machine Learning Approaches., , , , , and . ICTA, page 54-55. IEEE, (2022)A PAM4 transceiver design scheme with threshold adaptive and tap adaptive., , , , , and . EURASIP J. Adv. Signal Process., 2023 (1): 70 (December 2023)A 3D micro-channel cooling system embedded in LTCC packaging substrate., , , , , and . NEMS, page 649-652. IEEE, (2012)