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Post-Placement Optimization for Thermal-Induced Mechanical Stress Reduction.

T. Lu, Z. Yang, and A. Srivastava. ISVLSI, page 158-163. IEEE Computer Society, (2016)

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Zhiyuan Zhu

Zhiyuan Luo

Zhiyuan Zhang

Zhiyuan Sui

Zhiyuan Zhan

Other publications of authors with the same name

DRAMsim3: A Cycle-Accurate, Thermal-Capable DRAM Simulator.S. Li, Z. Yang, D. Reddy, A. Srivastava, and B. Jacob. IEEE Comput. Archit. Lett., 19 (2): 110-113 (2020)Premium Calculation for Insurance Businesses Based on Cyber Risks in IP-Based Power Substations.Z. Yang, Y. Liu, M. Campbell, C. Ten, Y. Rho, L. Wang, and W. Wei. IEEE Access, (2020)Smooth Tchebycheff Scalarization for Multi-Objective Optimization.X. Lin, X. Zhang, Z. Yang, F. Liu, Z. Wang, and Q. Zhang. CoRR, (2024)Adapting Segment Anything Model (SAM) through Prompt-based Learning for Enhanced Protein Identification in Cryo-EM Micrographs.F. He, Z. Yang, M. Gao, B. Poudel, N. Dhas, R. Gyawali, A. Dhakal, J. Cheng, and D. Xu. CoRR, (2023)T3DNet: Compressing Point Cloud Models for Lightweight 3D Recognition.Z. Yang, Y. Zhou, L. Xie, and J. Yang. CoRR, (2024)Thermoelectric Codesign of 3-D CPUs and Embedded Microfluidic Pin-Fin Heatsinks.C. Serafy, Z. Yang, A. Srivastava, Y. Hu, and Y. Joshi. IEEE Des. Test, 33 (2): 40-48 (2016)Enhanced Phase-Driven Q-Learning-Based DRM for Multicore Processors.Z. Yang, C. Serafy, T. Lu, and A. Srivastava. IEEE Trans. Comput. Aided Des. Integr. Circuits Syst., 38 (11): 2022-2031 (2019)TSV-Based 3-D ICs: Design Methods and Tools.T. Lu, C. Serafy, Z. Yang, S. Samal, S. Lim, and A. Srivastava. IEEE Trans. Comput. Aided Des. Integr. Circuits Syst., 36 (10): 1593-1619 (2017)Evaluation of SLAM Algorithms for Search and Rescue Applications.Z. Yang, N. Naz, P. Liu, and M. Huda. TAROS, volume 14136 of Lecture Notes in Computer Science, page 114-125. Springer, (2023)ECO Based Placement and Routing Framework for 3D FPGAs with Micro-fluidic Cooling.Z. Yang, C. Serafy, and A. Srivastava. FCCM, page 199. IEEE Computer Society, (2016)

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Disambiguation of "Yang, Zhiyuan"

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Post-Placement Optimization for Thermal-Induced Mechanical Stress Reduction.

Please choose a person to relate this publication to

Zhiyuan Zhu

Zhiyuan Luo

Zhiyuan Zhang

Zhiyuan Sui

Zhiyuan Zhan

Other publications of authors with the same name

Disambiguation

BibSonomy

Disambiguation of "Yang, Zhiyuan"

copydeleteadd this publication to your clipboardcommunity posthistory of this postURLDOIBibTeXEndNoteAPAChicagoDIN 1505HarvardMSOffice XML Post-Placement Optimization for Thermal-Induced Mechanical Stress Reduction.

Please choose a person to relate this publication to

Zhiyuan Zhu

Zhiyuan Luo

Zhiyuan Zhang

Zhiyuan Sui

Zhiyuan Zhan

Other publications of authors with the same name

Disambiguation

copy delete add this publication to your clipboard
community post
history of this post
URL
DOI
BibTeX
EndNote
APA
Chicago
DIN 1505
Harvard
MSOffice XML

Post-Placement Optimization for Thermal-Induced Mechanical Stress Reduction.