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Three-Dimensional Dynamic Random Access Memories Using Through-Silicon-Vias., , , , , , , , и . IEEE J. Emerg. Sel. Topics Circuits Syst., 6 (3): 373-384 (2016)Transkribus entziffert Uromas Handschrift. (мая 2018)Analysis of residual stresses and wear mechanism of HF-CVD diamond coated cemented carbide tools., , , , , , , и . Prod. Eng., 9 (1): 99-107 (2015)Hybrid III-V laser integration on a monolithic silicon photonic platform., , , , , , , , , и 39 other автор(ы). OFC, стр. 1-3. IEEE, (2021)A CMOS Compatible Monolithic Fiber Attach Solution with Reliable Performance and Self-Alignment., , , , , , , , , и 16 other автор(ы). OFC, стр. 1-3. IEEE, (2020)3-Stage Miller Cross-Coupled Load based Photodiode Readout for Glucose Monitoring., , и . EMBC, стр. 3918-3921. IEEE, (2018)Baustein auf Baustein: Eine Website mit Textpattern betreiben. c't, (2014)Impact of 3D copper TSV integration on 32SOI FEOL and BEOL reliability., , , , , , , , , и 7 other автор(ы). IRPS, стр. 4. IEEE, (2015)Myths and Misconceptions Around Reducing Carbon Embedded in Cloud Platforms., , , , , , , , , и . HotCarbon, стр. 7:1-7:7. ACM, (2023)Ensō: A Streaming Interface for NIC-Application Communication., , , , , , , и . OSDI, стр. 1005-1025. USENIX Association, (2023)