( en | de | ru )

 

Disambiguation

From post

копироватьудалитьдобавить публикацию в буфер
An error tolerance scheme for 3D CMOS imagers.

, , , , и . DAC, стр. 917-922. ACM, (2010)

Please choose a person to relate this publication to

To differ between persons with the same name, the academic degree and the title of an important publication will be displayed.

Ming-tjüan Ding

Ding Ding

Ding Ding

Tin-Kwai Man

Helmar Minger

 

Другие публикации лиц с тем же именем

Intra-channel Reconfigurable Interface for TSV and Micro Bump Fault Tolerance in 3-D RAMs., , , , , , , и . ATS, стр. 143-148. IEEE Computer Society, (2014)Tight Bounds on the Diameter of Gaussian Cubes., и . Comput. J., 41 (1): 52-56 (1998)FlexiVia ROM Compiler Programmable on Different Via Layers Based on Top Metal Assignment., , , , , , , , , и 1 other автор(ы). MTDT, стр. 28-33. IEEE Computer Society, (2006)Scalability of Programmable FIR Digital Filters., и . VLSI Signal Processing, 21 (1): 31-35 (1999)CAD reference flow for 3D via-last integrated circuits., , , , и . ASP-DAC, стр. 187-192. IEEE, (2010)Data Flow Representation of Iterative Algorithms for Systolic Arrays., и . IEEE Trans. Computers, 41 (3): 351-355 (1992)DLL-Assisted Clock Synchronization Method for Multi-Die ICs., , , и . ICCD, стр. 473-476. IEEE Computer Society, (2017)Improving power delivery network design by practical methodologies., , , , , , и . ICCD, стр. 237-242. IEEE Computer Society, (2014)On Tolerating Faults of TSV/Microbumps for Power Delivery Networks in 3D IC., , , , , , , , и . ISVLSI, стр. 459-464. IEEE Computer Society, (2017)Special session 4C: Hot topic 3D-IC design and test., , , , и . VTS, стр. 1. IEEE Computer Society, (2013)