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Interfacial reaction and mechanical evaluation in multi-level assembly joints with ENEPIG under bump metallization via drop and high speed impact test.

H. Lin, C. Ho, W. Chen, Y. Wu, D. Wang, J. Lin, Y. Wu, H. Hong, Z. Lin, and J. Duh. Microelectron. Reliab., 55 (1): 231-237 (2015)

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Zhi Wei

Wei Lin

Zhi-Wei Fan

Yong-zhi Lin

Other publications of authors with the same name

Network OAM requirements for the New York City transit network.Z. Lin. IEEE Communications Magazine, 42 (10): 112-116 (2004)Documentation of IANA assignments for Generalized MultiProtocol Label Switching (GMPLS) Resource Reservation Protocol - Traffic Engineering (RSVP-TE) Usage and Extensions for Automatically Switched Optical Network (ASON).Z. Lin, and D. Pendarakis. RFC, (March 2003)Five-axis tool path generation in CNC machining of T-spline surfaces.W. Gan, J. Fu, H. Shen, Z. Chen, and Z. Lin. Comput. Aided Des., (2014)A fine-interpolation-based parametric interpolation method with a novel real-time look-ahead algorithm.Y. Jin, Y. He, J. Fu, Z. Lin, and W. Gan. Comput. Aided Des., (2014)Development Tendency of Double-Layer Digital Divide in Mainland China: A Longitudinal Study Based on Perspective of Group Segmentation.L. Luo, and Z. Lin. IDIA, volume 1236 of Communications in Computer and Information Science, page 170-185. Springer, (2020)Resisting attacks from rogue HeNB.C. Tsai, C. Kao, C. Huang, and Z. Lin. DSC, page 522-523. IEEE, (2017)Interfacial reaction and mechanical evaluation in multi-level assembly joints with ENEPIG under bump metallization via drop and high speed impact test.H. Lin, C. Ho, W. Chen, Y. Wu, D. Wang, J. Lin, Y. Wu, H. Hong, Z. Lin, and J. Duh. Microelectron. Reliab., 55 (1): 231-237 (2015)Pingmesh: A Large-Scale System for Data Center Network Latency Measurement and Analysis.C. Guo, L. Yuan, D. Xiang, Y. Dang, R. Huang, D. Maltz, Z. Liu, V. Wang, B. Pang, H. Chen and 2 other author(s). SIGCOMM, page 139-152. ACM, (2015)Architecting the services optical network.E. Varma, S. Sankaranarayanan, G. Newsome, Z. Lin, and H. Epstein. IEEE Commun. Mag., 39 (9): 80-87 (2001)An $890\muW$ Multichannel Injection-Locked OOK Transmitter with 23% Global Efficiency and 22 pJ/bit Energy Efficiency.S. Chang, S. Chang, Z. Lin, and K. Cheng. A-SSCC, page 1-3. IEEE, (2023)

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Disambiguation of "Lin, Zhi-Wei"

Please choose a person to relate this publication to

Zhi Wei

Wei Lin

Wei Lin

Zhi-Wei Fan

Yong-zhi Lin

Other publications of authors with the same name

Disambiguation

BibSonomy

Disambiguation of "Lin, Zhi-Wei"

copydeleteadd this publication to your clipboardcommunity posthistory of this postURLDOIBibTeXEndNoteAPAChicagoDIN 1505HarvardMSOffice XML Interfacial reaction and mechanical evaluation in multi-level assembly joints with ENEPIG under bump metallization via drop and high speed impact test.

Please choose a person to relate this publication to

Zhi Wei

Wei Lin

Wei Lin

Zhi-Wei Fan

Yong-zhi Lin

Other publications of authors with the same name

Disambiguation