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Power delivery network design for wiring and TSV resource minimization in TSV-based 3-D ICs.

, , , , and . VLSI-DAT, page 1-4. IEEE, (2013)

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Power delivery network design for wiring and TSV resource minimization in TSV-based 3-D ICs., , , , and . VLSI-DAT, page 1-4. IEEE, (2013)Simultaneous Buffer-sizing and Wire-sizing for Clock Trees Based on Lagrangian Relaxation., , , and . VLSI Design, 15 (3): 587-594 (2002)NUMANA: a hybrid <u>num</u>erical and <u>ana</u>lytical thermal simulator for 3-D ICs., , , and . DATE, page 1379-1384. EDA Consortium San Jose, CA, USA / ACM DL, (2013)On-chip statistical hot-spot estimation using mixed-mesh statistical polynomial expression generating and skew-normal based moment matching techniques., , and . ASP-DAC, page 603-608. IEEE, (2012)A multiple supply voltage based power reduction method in 3-D ICs considering process variations and thermal effects., , and . ASP-DAC, page 55-60. IEEE, (2009)Power grid transient simulation in linear time based on transmission-line-modeling alternating-direction-implicit method., and . IEEE Trans. Comput. Aided Des. Integr. Circuits Syst., 21 (11): 1343-1352 (2002)LUTSim: A Look-Up Table-Based Thermal Simulator for 3-D ICs., , , and . IEEE Trans. Comput. Aided Des. Integr. Circuits Syst., 34 (8): 1250-1263 (2015)Thermal Pad Design Flow for Automotive Electronics., , , and . ICCE-TW, page 1-2. IEEE, (2021)NGOSS-centric Framework of Telecommunication Electronic Commerce., and . ISCSCT (2), page 320-323. IEEE Computer Society, (2008)Power Grid Transient Simulation in Linear Time Based on Transmission-Line-Modeling Alternating-Direction-Implicit Method., and . ICCAD, page 75-. IEEE Computer Society, (2001)