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Power delivery network design for wiring and TSV resource minimization in TSV-based 3-D ICs.

, , , , и . VLSI-DAT, стр. 1-4. IEEE, (2013)

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Chia-Chun Liang

Chia-Liang Lin

Chia-Cheng Wu

Liang Liang

Cheng-Yung Cheng

 

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Cost-Effective TAP-Controlled Serialized Compressed Scan Architecture for 3D Stacked ICs., , , , , , и . Asian Test Symposium, стр. 107-108. IEEE Computer Society, (2013)Power delivery network design for wiring and TSV resource minimization in TSV-based 3-D ICs., , , , и . VLSI-DAT, стр. 1-4. IEEE, (2013)Benchmarking for research in power delivery networks of three-dimensional integrated circuits., , , , , , , , и . ISPD, стр. 17-24. ACM, (2013)Methodology of exploring ESL/RTL many-core platforms for developing embedded parallel applications., , , , , , и . SoCC, стр. 286-291. IEEE, (2014)Thermal modeling and design on smartphones with heat pipe cooling technique., , , и . ICCAD, стр. 482-489. IEEE, (2017)Approximate Computing for Batch Learning in Neural Network., , , и . ICCE-TW, стр. 1-2. IEEE, (2020)A 0.48V 0.57nJ/pixel video-recording SoC in 65nm CMOS., , , , , , , , , и 8 other автор(ы). ISSCC, стр. 158-159. IEEE, (2013)Reliable Power Delivery System Design for Three-Dimensional Integrated Circuits (3D ICs)., , , , , и . ISVLSI, стр. 356-361. IEEE Computer Society, (2012)Capturing the phantom of the power grid - on the runtime adaptive techniques for noise reduction., , , , , и . ASP-DAC, стр. 640-645. IEEE, (2012)Ping-Pong Mesh: A New Resonant Clock Design for Surge Current and Area Overhead Reduction., , , , , , и . IEEE Trans. Comput. Aided Des. Integr. Circuits Syst., 36 (1): 146-155 (2017)