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Methodology for Active Junction Profile Extraction in thin film FD-SOI Enabling performance driver identification in 500°C devices for 3D sequential integration.

T. Frutuoso, X. Garros, P. Batude, L. Brunet, J. Lacord, B. Sklénard, V. Lapras, C. Fenouillet-Béranger, M. Ribotta, A. Magalhaes-Lucas, J. Kanyandekwe, R. Kies, G. Romano, E. Catapano, M. Cassé, J. Lugo-Alvarez, P. Ferrari, and F. Gaillard. VLSI Technology and Circuits, page 332-333. IEEE, (2022)

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Claire Eschbach

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