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Interconnect characteristics of 2.5-D system integration scheme., и . ISPD, стр. 171-175. ACM, (2001)Systematic Characterization of Physical Defects for Fault Analysis of MOS IC Cells., , и . ITC, стр. 390-399. IEEE Computer Society, (1984)Improving the Quality of Test Education.. ITC, стр. 1119. IEEE Computer Society, (1991)Prospects for WSI: A Manufacturing Perspective.. Computer, 25 (4): 58-65 (1992)Fault Tuples in Diagnosis of Deep-Submicron Circuits., , , , , и . ITC, стр. 233-241. IEEE Computer Society, (2002)2.5D system integration: a design driven system implementation schema., и . ASP-DAC, стр. 450-455. IEEE Computer Society, (2004)Improved Yield Model for Submicron Domain., и . DFT, стр. 2-10. IEEE Computer Society, (1997)Process Monitoring Oriented IC Testing., и . ITC, стр. 527-532. IEEE Computer Society, (1989)Current testing.. ITC, стр. 257. IEEE Computer Society, (1990)To DFT or Not to DFT?, , , , и . ITC, стр. 557-566. IEEE Computer Society, (1997)