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Reliability analysis and comparison of ring-PUF based on probabilistic models.

J. Bian, Z. Huang, Y. Lin, Z. Yang, H. Liang, and T. Ni. Microelectron. J., (February 2024)

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Ying Ni

Pedestrian safety at urban signalised intersectionsY. Ni. TU Darmstadt, (2009)

Yi Ni

Ji Ni

Xiaoju Ni

Zhixu Ni

Other publications of authors with the same name

A Novel Built-In Self-Repair Scheme for 3D Memory.T. Ni, H. Chang, Y. Yao, X. Li, and Z. Huang. IEEE Access, (2019)A Pulse Shrinking-Based Test Solution for Prebond Through Silicon via in 3-D ICs.M. Yi, J. Bian, T. Ni, C. Jiang, H. Chang, and H. Liang. IEEE Trans. Comput. Aided Des. Integr. Circuits Syst., 38 (4): 755-766 (2019)LCHR-TSV: Novel Low Cost and Highly Repairable Honeycomb-Based TSV Redundancy Architecture for Clustered Faults.T. Ni, Y. Yao, H. Chang, L. Lu, H. Liang, A. Yan, Z. Huang, and X. Wen. IEEE Trans. Comput. Aided Des. Integr. Circuits Syst., 39 (10): 2938-2951 (2020)Design of True Random Number Generator Based on Multi-Stage Feedback Ring Oscillator.J. Cui, M. Yi, D. Cao, L. Yao, X. Wang, H. Liang, Z. Huang, H. Qi, T. Ni, and Y. Lu. IEEE Trans. Circuits Syst. II Express Briefs, 69 (3): 1752-1756 (2022)Design of Radiation Hardened Latch and Flip-Flop with Cost-Effectiveness for Low-Orbit Aerospace Applications.A. Yan, A. Cao, Z. Xu, J. Cui, T. Ni, P. Girard, and X. Wen. J. Electron. Test., 37 (4): 489-502 (2021)A novel in-field TSV repair method for latent faults.T. Ni, H. Chang, H. Qi, and Z. Huang. IEICE Electron. Express, 15 (23): 20180873 (2018)Chip test pattern reordering method using adaptive test to reduce cost for testing of ICs.T. Song, H. Liang, Z. Huang, T. Ni, and Y. Sun. IEICE Electron. Express, 18 (2): 20200420 (2021)Fortune: A New Fault-Tolerance TSV Configuration in Router-Based Redundancy Structure.Q. Xu, H. Geng, T. Ni, S. Chen, B. Yu, Y. Kang, and X. Wen. IEEE Trans. Comput. Aided Des. Integr. Circuits Syst., 41 (10): 3182-3187 (2022)Design of True Random Number Generator Based on Multi-Ring Convergence Oscillator Using Short Pulse Enhanced Randomness.T. Ni, Q. Peng, J. Bian, L. Yao, Z. Huang, A. Yan, S. Wang, and X. Wen. IEEE Trans. Circuits Syst. I Regul. Pap., 70 (12): 5074-5085 (December 2023)SCLCRL: Shuttling C-elements based Low-Cost and Robust Latch Design Protected against Triple Node Upsets in Harsh Radiation Environments.A. Yan, Z. Li, S. Huang, Z. Zhai, X. Cheng, J. Cui, T. Ni, X. Wen, and P. Girard. DATE, page 1257-1262. IEEE, (2022)

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Disambiguation of "Ni, Tianming"

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Reliability analysis and comparison of ring-PUF based on probabilistic models.

Please choose a person to relate this publication to

Ying Ni

Yi Ni

Ji Ni

Xiaoju Ni

Zhixu Ni

Other publications of authors with the same name

Disambiguation

BibSonomy

Disambiguation of "Ni, Tianming"

copydeleteadd this publication to your clipboardcommunity posthistory of this postURLDOIBibTeXEndNoteAPAChicagoDIN 1505HarvardMSOffice XML Reliability analysis and comparison of ring-PUF based on probabilistic models.

Please choose a person to relate this publication to

Ying Ni

Yi Ni

Ji Ni

Xiaoju Ni

Zhixu Ni

Other publications of authors with the same name

Disambiguation

copy delete add this publication to your clipboard
community post
history of this post
URL
DOI
BibTeX
EndNote
APA
Chicago
DIN 1505
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Reliability analysis and comparison of ring-PUF based on probabilistic models.