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Modeling the Economics of Testing: A DFT Perspective.

, , , , и . IEEE Des. Test Comput., 19 (1): 29-41 (2002)

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Systematic Characterization of Physical Defects for Fault Analysis of MOS IC Cells., , и . ITC, стр. 390-399. IEEE Computer Society, (1984)Interconnect characteristics of 2.5-D system integration scheme., и . ISPD, стр. 171-175. ACM, (2001)Prospects for WSI: A Manufacturing Perspective.. Computer, 25 (4): 58-65 (1992)Failure Analysis of High-Density CMOS SRAMs: Using Realistic Defect Modeling and I/Sub DDQ/ Testing., , и . IEEE Des. Test Comput., 10 (2): 13-23 (1993)Statistical Simulation of the IC Manufacturing Process., и . IEEE Trans. Comput. Aided Des. Integr. Circuits Syst., 1 (3): 120-131 (1982)Improving the Quality of Test Education.. ITC, стр. 1119. IEEE Computer Society, (1991)Computer-aided design for VLSI circuit manufacturability.. Proc. IEEE, 78 (2): 356-392 (1990)Fault Tuples in Diagnosis of Deep-Submicron Circuits., , , , , и . ITC, стр. 233-241. IEEE Computer Society, (2002)2.5D system integration: a design driven system implementation schema., и . ASP-DAC, стр. 450-455. IEEE Computer Society, (2004)Process Monitoring Oriented IC Testing., и . ITC, стр. 527-532. IEEE Computer Society, (1989)