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Disambiguation of "Blaicher, Matthias"

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Four-Channel 784 Gbit/s Transmitter Module Enabled by Photonic Wire Bonding and Silicon-Organic Hybrid Modulators.

, , , , , , , , , , , , , , , and . ECOC, page 1-3. IEEE, (2017)

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Günther Blaicher

Wolfgang Blaicher

Ernst Blaicher

Matthias Hägele

Immunrekonstitution nach haploidenter hämatopoetischer Stammzelltransplantation: Einfluss eines CD3-CD19-depletierten gegenüber einem CD34-selektionierten Transplantat. Uni Tübingen, (2008)

Matthias Meyer

Musterbasiertes Re-Engineering von Softwaresystemen. Uni Paderborn, (2009)
 

Other publications of authors with the same name

Hybrid 2D/3D photonic integration for non-planar circuit topologies., , , , , , , , , and . CoRR, (2019)Photonic Wire Bonding and 3D Nanoprinting in Photonic Integration - from Lab Demonstrations to Production., , , , , , , , , and 1 other author(s). ECOC, page 1-2. IEEE, (2018)Hardwired Configurable Photonic Integrated Circuits Enabled by 3D Nanoprinting., , , , , , , , , and . ECOC, page 1-3. IEEE, (2018)Efficient Coupling Interfaces in Photonic Systems Enabled by Printed Freeform Micro-Optics., , , , , , , , , and . ICTON, page 1-2. IEEE, (2018)3D-Printed Optical Elements for Coupling of VCSEL and Photodiode Arrays to Multi-Core Fibers in an SFP Transceiver Assembly., , , , , , , , , and 4 other author(s). OFC, page 1-3. IEEE, (2022)Multi-chip integration by photonic wire bonding: Connecting surface and edge emitting lasers to silicon chips., , , , , , , , , and 5 other author(s). OFC, page 1-3. IEEE, (2016)InP/Silicon Hybrid External-Cavity Lasers (ECL) using Photonic Wirebonds as Coupling Elements., , , , , , , , , and 2 other author(s). OFC, page 1-3. IEEE, (2020)8-Channel 448 Gbit/s silicon photonic transmitter enabled by photonic wire bonding., , , , , , , , , and 4 other author(s). OFC, page 1-3. IEEE, (2017)Four-Channel 784 Gbit/s Transmitter Module Enabled by Photonic Wire Bonding and Silicon-Organic Hybrid Modulators., , , , , , , , , and 6 other author(s). ECOC, page 1-3. IEEE, (2017)3D-Printed Optics for Wafer-Scale Probing., , , , , , , and . ECOC, page 1-3. IEEE, (2018)