Author of the publication

Please choose a person to relate this publication to

To differ between persons with the same name, the academic degree and the title of an important publication will be displayed. You can also use the button next to the name to display some publications already assigned to the person.

 

Other publications of authors with the same name

Silicon photonic integrated circuits for optical coherence tomography., , , , , and . ICTON, page 1-4. IEEE, (2016)Photonic Wire Bonding and 3D Nanoprinting in Photonic Integration - from Lab Demonstrations to Production., , , , , , , , , and 1 other author(s). ECOC, page 1-2. IEEE, (2018)Hardwired Configurable Photonic Integrated Circuits Enabled by 3D Nanoprinting., , , , , , , , , and . ECOC, page 1-3. IEEE, (2018)InP/Silicon Hybrid External-Cavity Lasers (ECL) using Photonic Wirebonds as Coupling Elements., , , , , , , , , and 2 other author(s). OFC, page 1-3. IEEE, (2020)3D-Printed Optics for Wafer-Scale Probing., , , , , , , and . ECOC, page 1-3. IEEE, (2018)8-Channel 448 Gbit/s silicon photonic transmitter enabled by photonic wire bonding., , , , , , , , , and 4 other author(s). OFC, page 1-3. IEEE, (2017)Four-Channel 784 Gbit/s Transmitter Module Enabled by Photonic Wire Bonding and Silicon-Organic Hybrid Modulators., , , , , , , , , and 6 other author(s). ECOC, page 1-3. IEEE, (2017)Efficient Coupling Interfaces in Photonic Systems Enabled by Printed Freeform Micro-Optics., , , , , , , , , and . ICTON, page 1-2. IEEE, (2018)3D-Printed Optical Elements for Coupling of VCSEL and Photodiode Arrays to Multi-Core Fibers in an SFP Transceiver Assembly., , , , , , , , , and 4 other author(s). OFC, page 1-3. IEEE, (2022)Multi-chip integration by photonic wire bonding: Connecting surface and edge emitting lasers to silicon chips., , , , , , , , , and 5 other author(s). OFC, page 1-3. IEEE, (2016)