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Reducing IR drop in 3D integration to less than 1/4 using Buck Converter on Top die (BCT) scheme., , , , , , , и . ISQED, стр. 210-215. IEEE, (2013)A 0.14pJ/b Inductive-Coupling Inter-Chip Data Transceiver with Digitally-Controlled Precise Pulse Shaping., , , и . ISSCC, стр. 358-608. IEEE, (2007)A 1.8V 30nJ adaptive program-voltage (20V) generator for 3D-integrated NAND flash SSD., , , , , , и . ISSCC, стр. 238-239. IEEE, (2009)A 2Gb/s 15pJ/b/chip Inductive-Coupling programmable bus for NAND Flash memory stacking., , , , , , , и . ISSCC, стр. 244-245. IEEE, (2009)Ambient electronics and ultra-low power LSI design.. VLSI-DAT, стр. 1-31. IEEE, (2012)High-Speed Circuit Design with Scaled-Down MOSFET's and Low Supply Voltage.. ISCAS, стр. 1487-1490. IEEE, (1993)Silicon 3D-integration technology and systems., , , , , , , , , и . ISSCC, стр. 510-511. IEEE, (2010)Inductor design of 20-V boost converter for low power 3D solid state drive with NAND flash memories., , , , , , и . ISLPED, стр. 87-92. ACM, (2009)Meeting with the forthcoming IC design.. SBCCI, стр. 2. ACM, (2007)Variable threshold CMOS (VTCMOS) in series connected circuits., , и . ISLPED, стр. 201-206. ACM, (2001)