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Session 2 overview: Processors: Digital architectures and systems subcommittee.

, , and . ISSCC, page 32-33. IEEE, (2018)

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Switching constraint-driven thermal and reliability analysis of Nanometer designs., , , , and . ISQED, page 473-480. IEEE, (2011)Session 3 overview: Digital processors., , and . ISSCC, page 48-49. IEEE, (2017)Pioneering Chiplet Technology and Design for the AMD EPYC™ and Ryzen™ Processor Families : Industrial Product., , , , , , and . ISCA, page 57-70. IEEE, (2021)Session 2 overview: Processors: Digital architectures and systems subcommittee., , and . ISSCC, page 32-33. IEEE, (2018)2.2 "Zen 4c": The AMD 5nm Area-Optimized ×86-64 Microprocessor Core., , , , , , , , , and 22 other author(s). ISSCC, page 38-40. IEEE, (2024)Zen3: The AMD 2nd-Generation 7nm x86-64 Microprocessor Core., , , , , , , , , and 20 other author(s). ISSCC, page 1-3. IEEE, (2022)SE1: What Technologies Will Shape the Future of Computing?, , , , , , , , , and . ISSCC, page 537-538. IEEE, (2021)"Zeppelin": An SoC for Multichip Architectures., , , , , , , , and . IEEE J. Solid State Circuits, 54 (1): 133-143 (2019)Session 3 Overview: Highlighted Chip Releases: Modern Digital SoCs Invited Papers., , and . ISSCC, page 44-45. IEEE, (2021)Research challenges in wireless multimedia., , , , , , , , , and 1 other author(s). PIMRC, page 1-5. (1994)