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Efficient thermal-oriented 3D floorplanning and thermal via planning for two-stacked-die integration.

, , , , , and . ACM Trans. Design Autom. Electr. Syst., 11 (2): 325-345 (2006)

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A Hitchhiker's Guide to the DFM Universe.. APCCAS, page 1103-1106. IEEE, (2006)Embedded tutorial I: design for manufacturability.. ASP-DAC, ACM Press, (2005)Who solves the variability problem?, , , , , , , and . DAC, page 218-219. ACM, (2010)Efficient thermal-oriented 3D floorplanning and thermal via planning for two-stacked-die integration., , , , , and . ACM Trans. Design Autom. Electr. Syst., 11 (2): 325-345 (2006)Multi-schedule design space exploration: an alternative synthesis framework., and . Integr., 27 (2): 87-112 (1999)Efficient Thermal via Planning Approach and Its Application in 3-D Floorplanning., , , , , , , , and . IEEE Trans. Comput. Aided Des. Integr. Circuits Syst., 26 (4): 645-658 (2007)Quadrisectioning Based Placement with a Normalized Mean Field Neural Network., and . ISCAS, page 2047-2050. IEEE, (1993)An Experiment in Programming with Full First-Order Logic., and . SLP, page 40-47. IEEE-CS, (1985)Verification of Register Transfer Level Parallel Control Sequences., and . IEEE Trans. Computers, 34 (8): 761-765 (1985)Solving the scheduling problem in high level synthesis using a normalized mean field neural network., , and . ICNN, page 275-280. IEEE, (1993)