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A 3T or 4T pixel compatible DR extension technique suitable for 3D-IC imagers: A 800×512 and 5μm pixel pitch 2D demonstrator.

, , , , , , , and . ISCAS, page 1094-1097. IEEE, (2015)

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A 3T or 4T pixel compatible DR extension technique suitable for 3D-IC imagers: A 800×512 and 5μm pixel pitch 2D demonstrator., , , , , , , and . ISCAS, page 1094-1097. IEEE, (2015)Adaptive Multiresolution for Low Power CMOS Image Sensor., , , , and . ICIP (5), page 185-188. IEEE, (2007)Benefits of three-dimensional circuit stacking for image sensors., , , and . NEWCAS, page 1-4. IEEE, (2013)A low drift, low noise detection IC applied to MEMS gyros., , , and . ICECS, page 46-49. IEEE, (2007)A 120μW 240×110@25fps vision chip with ROI detection SIMD processing unit., , , , , and . ISCAS, page 2412-2415. IEEE, (2013)Image Processing Vision Systems: Standard Image Sensors Versus Retinas., , , , , and . IEEE Trans. Instrumentation and Measurement, 56 (5): 1675-1687 (2007)Co-integration of a smart CMOS image sensor and a spatial light modulator for real-time optical phase modulation., , , , , and . IMSE, volume 9022 of SPIE Proceedings, page 90220N. SPIE, (2014)A near pixel Depth from Focus architecture for video rate depth estimation., , , , and . IMSE, page 1-6. Society for Imaging Science and Technology, (2018)Perceptual image quality assessment metric that handles arbitrary motion blur., , , , and . IQSP, volume 8293 of SPIE Proceedings, page 829314. SPIE, (2012)Session 21 overview: Innovative personalized biomédical systems: Technology directions subcommittee., and . ISSCC, page 378-379. IEEE, (2015)