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A process variation compensation scheme using cell-based forward body-biasing circuits usable for 1.2V design., , , , , , , , , and 2 other author(s). CICC, page 29-32. IEEE, (2008)A soft-error hardened latch scheme for SoC in a 90 nm technology and beyond., , , , and . CICC, page 329-332. IEEE, (2004)Practical Evaluation of Printed Strain Sensors Based on Long-Term Static Strain Measurements., , , , and . Sensors, 21 (14): 4812 (2021)Power Valve: for low power operation and low stand-by power., , and . IEICE Electron. Express, 2 (3): 64-69 (2005)Ultra-thin piezoelectric strain sensor array integrated on flexible printed circuit for structural health monitoring., , , , , , and . IEEE SENSORS, page 1-3. IEEE, (2016)Adaptive load sharing for hybrid controlled two cooperative manipulators., and . ICRA, page 986-991. IEEE Computer Society, (1991)Effect of Surface Property on Transfer-Print of Au Thin-Film to Micro-Structured Substrate., , and . IJAT, 9 (4): 411-417 (2015)A 512Gb 3b/Cell 3D flash memory on a 96-word-line-layer technology., , , , , , , , , and 54 other author(s). ISSCC, page 336-338. IEEE, (2018)Low-Voltage and Low-Power Logic, Memory, and Analog Circuit Techniques for SoCs Using 90 nm Technology and Beyond., , , , , , , , , and 4 other author(s). IEICE Trans. Electron., 89-C (3): 250-262 (2006)Fabrication of conductive polymer coated elastomer contact structures using a reel-to-reel continuous fiber process., , , and . IEICE Electron. Express, 9 (17): 1442-1447 (2012)