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Advanced thermal simulation of SiGe: C HBTs including back-end-of-line., , , , and . Microelectron. Reliab., (2016)Partition-based approach to parametric dynamic compact thermal modeling., , , , , , and . Microelectron. Reliab., (2017)Analysis of the UIS behavior of power devices by means of SPICE-based electrothermal simulations., , , , , , and . Microelectron. Reliab., 53 (9-11): 1713-1718 (2013)Si/SiGe: C and InP/GaAsSb Heterojunction Bipolar Transistors for THz Applications., , , , , , , , , and 8 other author(s). Proc. IEEE, 105 (6): 1035-1050 (2017)Multi-port dynamic compact thermal models of dual-chip package using model order reduction and metaheuristic optimization., , , , , , , , , and . Microelectron. Reliab., (2018)Simulation comparison of InGaP/GaAs HBT thermal performance in wire-bonding and flip-chip technologies., , , , , , and . Microelectron. Reliab., (2017)Avalanche multiplication and pinch-in models for simulating electrical instability effects in SiGe HBTs., , and . Microelectron. Reliab., 50 (9-11): 1577-1580 (2010)Evaluation of thermal balancing techniques in InGaP/GaAs HBT power arrays for wireless handset power amplifiers., , , and . Microelectron. Reliab., 53 (9-11): 1471-1475 (2013)Dynamic electrothermal macromodeling techniques for thermal-aware design of circuits and systems., , , , and . PATMOS, page 227-230. IEEE, (2013)Analytical Solutions of the Diffusive Heat Equation as the Application for Multi-cellular Device Modeling - A Numerical Aspect., , , and . International Conference on Computational Science, volume 3039 of Lecture Notes in Computer Science, page 1021-1028. Springer, (2004)