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Advanced thermal simulation of SiGe: C HBTs including back-end-of-line., , , , and . Microelectron. Reliab., (2016)Partition-based approach to parametric dynamic compact thermal modeling., , , , , , and . Microelectron. Reliab., (2017)Analysis of the UIS behavior of power devices by means of SPICE-based electrothermal simulations., , , , , , and . Microelectron. Reliab., 53 (9-11): 1713-1718 (2013)Si/SiGe: C and InP/GaAsSb Heterojunction Bipolar Transistors for THz Applications., , , , , , , , , and 8 other author(s). Proc. IEEE, 105 (6): 1035-1050 (2017)Multi-port dynamic compact thermal models of dual-chip package using model order reduction and metaheuristic optimization., , , , , , , , , and . Microelectron. Reliab., (2018)Avalanche multiplication and pinch-in models for simulating electrical instability effects in SiGe HBTs., , and . Microelectron. Reliab., 50 (9-11): 1577-1580 (2010)Simulation comparison of InGaP/GaAs HBT thermal performance in wire-bonding and flip-chip technologies., , , , , , and . Microelectron. Reliab., (2017)An Experimental Power-Lines Model for Digital ASICs Based on Transmission Lines., , , , , , and . IEEE Trans. Very Large Scale Integr. Syst., 20 (1): 162-166 (2012)Structure-preserving approach to multi-port dynamic compact models of nonlinear heat conduction., , , and . Microelectron. J., 46 (12): 1129-1137 (2015)Reliability of high-speed SiGe: C HBT under electrical stress close to the SOA limit., , , , , , , and . Microelectron. Reliab., 55 (9-10): 1433-1437 (2015)