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Solder interconnection failure time estimation based on the embedded precursor behaviour modelling.

, , and . Microelectron. Reliab., 51 (2): 425-436 (2011)

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A Frequency Mixing and Sub-Sampling Based RF-Measurement Apparatus for IEEE 1149.4., , , and . ITC, page 551-559. IEEE Computer Society, (2004)IEEE 1149.4 Compatible ABMs for Basic RF Measurements., , and . DATE, page 172-173. IEEE Computer Society, (2005)Methods of Testing Discrete Semiconductors in the 1149.4 Environment., and . J. Electron. Test., 23 (6): 581-592 (2007)Component Value Calculations and Characterizations for Measurements in the IEEE 1149.4 Environment., and . J. Electron. Test., 23 (6): 569-579 (2007)IEEE 1149.4 Compatible ABMs for Basic RF Measurements, , and . CoRR, (2007)A prognostic method for the embedded failure monitoring of solder interconnections with 1149.4 test bus architecture., , , and . Microelectron. J., 40 (7): 1069-1080 (2009)Solder interconnection failure time estimation based on the embedded precursor behaviour modelling., , and . Microelectron. Reliab., 51 (2): 425-436 (2011)Enabling Remote Testing: Embedded Test Controller and Mixed-signal Test Architecture., , , , and . J. Electron. Test., 26 (6): 641-658 (2010)Current State of the Mixed-Signal Test Bus 1149.4., , , , and . J. Electron. Test., 28 (6): 857-863 (2012)