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Color shift acceleration on mid-power LED packages., , , , , and . Microelectron. Reliab., (2017)Predictive modeling of board level shock-impact reliability of the HVQFN-family., , and . Microelectron. Reliab., 50 (2): 228-234 (2010)Numerical modeling of warpage induced in QFN array molding process., , , , , , and . Microelectron. Reliab., 47 (2-3): 310-318 (2007)Packaging influences on the reliability of MEMS resonators., , , , , and . Microelectron. Reliab., 48 (8-9): 1567-1571 (2008)Prediction of Delamination Related IC & Packaging Reliability Problems., , , and . Microelectron. Reliab., 45 (9-11): 1633-1638 (2005)Virtual qualification of moisture induced failures of advanced packages., , , , , , and . Microelectron. Reliab., 47 (2-3): 273-279 (2007)Multiscale modelling of multilayer substrates., , , and . Microelectron. Reliab., 46 (9-11): 1472-1477 (2006)Correlation studies for component level ball impact shear test and board level drop test., , , , , , , , , and 3 other author(s). Microelectron. Reliab., 48 (7): 1069-1078 (2008)An approach to "Design for Reliability" in solid state lighting systems at high temperatures., , , , , , and . Microelectron. Reliab., 52 (5): 783-793 (2012)Advances in the drop-impact reliability of solder joints for mobile applications., , , , , and . Microelectron. Reliab., 49 (2): 139-149 (2009)