Author of the publication

Please choose a person to relate this publication to

To differ between persons with the same name, the academic degree and the title of an important publication will be displayed. You can also use the button next to the name to display some publications already assigned to the person.

 

Other publications of authors with the same name

How to study delamination in plastic encapsulated devices., , , and . Microelectron. Reliab., 44 (9-11): 1311-1316 (2004)A methodological approach for predictive reliability: Practical case studies., , , and . Microelectron. Reliab., 52 (12): 3035-3042 (2012)Microstructure evolution observation for SAC solder joint: Comparison between thermal cycling and thermal storage., , , , and . Microelectron. Reliab., 49 (9-11): 1267-1272 (2009)Editorial., , , , and . Microelectron. Reliab., 55 (9-10): 1269-1270 (2015)Sequential combined thermal cycling and vibration test and simulation of printed circuit board., , , and . Microelectron. Reliab., (2018)Electro- and thermo-migration induced failure mechanisms in Package on Package., , and . Microelectron. Reliab., 52 (12): 2889-2906 (2012)Effects of salt spray test on lead-free solder alloy., , , , and . Microelectron. Reliab., (2016)Dynamic void formation in a DD-copper-structure with different metallization geometry., , , and . Microelectron. Reliab., 47 (2-3): 319-325 (2007)Evaluation by three-point-bend and ball-on-ring tests of thinning process on silicon die strength., , , and . Microelectron. Reliab., 52 (9-10): 2278-2282 (2012)Electro- and thermomigration-induced IMC formation in SnAg3.0Cu0.5 solder joints on nickel gold pads., , , and . Microelectron. Reliab., 53 (9-11): 1575-1580 (2013)