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Design Issues and Considerations for Low-Cost 3-D TSV IC Technology.

G. der Plas, P. Limaye, I. Loi, A. Mercha, H. Oprins, C. Torregiani, S. Thijs, D. Linten, M. Stucchi, G. Katti, D. Velenis, V. Cherman, B. Vandevelde, V. Simons, I. Wolf, R. Labie, D. Perry, S. Bronckers, N. Minas, M. Cupac, W. Ruythooren, J. Olmen, A. Phommahaxay, M. de Potter de ten Broeck, A. Opdebeeck, M. Rakowski, B. Wachter, M. Dehan, M. Nelis, R. Agarwal, A. Pullini, F. Angiolini, L. Benini, W. Dehaene, Y. Travaly, E. Beyne, and P. Marchal. IEEE J. Solid State Circuits, 46 (1): 293-307 (2011)

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Katti Faceli

Emil Kattinger

Abdul Kader Kattih

Mohamad-Fouad Kattit

Gernot Kattinger

Other publications of authors with the same name

Capacitance Measurements of Two-Dimensional and Three-Dimensional IC Interconnect Structures by Quasi-Static C-V Technique.M. Stucchi, D. Velenis, and G. Katti. IEEE Trans. Instrumentation and Measurement, 61 (7): 1979-1990 (2012)3-D Technology Assessment: Path-Finding the Technology/Design Sweet-Spot.P. Marchal, B. Bougard, G. Katti, M. Stucchi, W. Dehaene, A. Papanikolaou, D. Verkest, B. Swinnen, and E. Beyne. Proc. IEEE, 97 (1): 96-107 (2009)Fabrication and Assembly of Cu-RDL-Based 2.5-D Low-Cost Through Silicon Interposer (LC-TSI).G. Katti, S. Ho, L. Yu, S. Zhang, R. Dutta, R. Weerasekera, K. Chang, J. Lin, S. Vempati, and S. Bhattacharya. IEEE Des. Test, 32 (4): 23-31 (2015)Design issues and considerations for low-cost 3D TSV IC technology.G. der Plas, P. Limaye, A. Mercha, H. Oprins, C. Torregiani, S. Thijs, D. Linten, M. Stucchi, G. Katti, D. Velenis and 24 other author(s). ISSCC, page 148-149. IEEE, (2010)3D Stacked IC demonstrator using Hybrid Collective Die-to-Wafer bonding with copper Through Silicon Vias (TSV).J. Olmen, J. Coenen, W. Dehaene, K. Meyer, C. Huyghebaert, A. Jourdain, G. Katti, A. Mercha, M. Rakowski, M. Stucchi and 3 other author(s). 3DIC, page 1-5. IEEE, (2009)Verifying electrical/thermal/thermo-mechanical behavior of a 3D stack - Challenges and solutions.G. der Plas, S. Thijs, D. Linten, G. Katti, P. Limaye, A. Mercha, M. Stucchi, H. Oprins, B. Vandevelde, N. Minas and 8 other author(s). CICC, page 1-4. IEEE, (2010)Design Issues and Considerations for Low-Cost 3-D TSV IC Technology.G. der Plas, P. Limaye, I. Loi, A. Mercha, H. Oprins, C. Torregiani, S. Thijs, D. Linten, M. Stucchi, G. Katti and 27 other author(s). IEEE J. Solid State Circuits, 46 (1): 293-307 (2011)

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Disambiguation of "Katti, Guruprasad"

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Design Issues and Considerations for Low-Cost 3-D TSV IC Technology.

Please choose a person to relate this publication to

Katti Faceli

Emil Kattinger

Abdul Kader Kattih

Mohamad-Fouad Kattit

Gernot Kattinger

Other publications of authors with the same name

Disambiguation

BibSonomy

Disambiguation of "Katti, Guruprasad"

copydeleteadd this publication to your clipboardcommunity posthistory of this postURLDOIBibTeXEndNoteAPAChicagoDIN 1505HarvardMSOffice XML Design Issues and Considerations for Low-Cost 3-D TSV IC Technology.

Please choose a person to relate this publication to

Katti Faceli

Emil Kattinger

Abdul Kader Kattih

Mohamad-Fouad Kattit

Gernot Kattinger

Other publications of authors with the same name

Disambiguation

copy delete add this publication to your clipboard
community post
history of this post
URL
DOI
BibTeX
EndNote
APA
Chicago
DIN 1505
Harvard
MSOffice XML

Design Issues and Considerations for Low-Cost 3-D TSV IC Technology.