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Including inductance in static timing analysis., , and . ICCAD, page 686-691. IEEE Computer Society, (2007)Fast and Accurate Full-chip Extraction and Optimization of TSV-to-Wire Coupling., , and . DAC, page 28:1-28:6. ACM, (2014)Simple and Accurate Models for Capacitance Increment due to Metal Fill Insertion., , and . ASP-DAC, page 456-461. IEEE Computer Society, (2007)On accurate full-chip extraction and optimization of TSV-to-TSV coupling elements in 3D ICs., , , and . ICCAD, page 281-288. IEEE, (2013)Coupling Extraction and Optimization for Heterogeneous 2.5D Chiplet-Package Co-Design., , and . ICCAD, page 3:1-3:8. IEEE, (2020)Efficient and accurate RIE modeling methodology for BEOL 2.5D parasitic extraction., , and . MWSCAS, page 519-522. IEEE, (2014)Full-Chip Electro-Thermal Coupling Extraction and Analysis for Face-to-Face Bonded 3D ICs., , , , , and . ISPD, page 39-46. ACM, (2020)Importance of volume discretization of single and coupled interconnects., , and . ICCAD, page 119-126. ACM, (2006)Robust verification of 3D-ICs: Pros, cons and recommendations., and . 3DIC, page 1-6. IEEE, (2009)Full-chip Inter-die Parasitic Extraction in Face-to-Face-Bonded 3D ICs., , , and . ICCAD, page 649-655. IEEE, (2015)