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A 3T or 4T pixel compatible DR extension technique suitable for 3D-IC imagers: A 800×512 and 5μm pixel pitch 2D demonstrator., , , , , , , и . ISCAS, стр. 1094-1097. IEEE, (2015)Adaptive Multiresolution for Low Power CMOS Image Sensor., , , , и . ICIP (5), стр. 185-188. IEEE, (2007)Benefits of three-dimensional circuit stacking for image sensors., , , и . NEWCAS, стр. 1-4. IEEE, (2013)A low drift, low noise detection IC applied to MEMS gyros., , , и . ICECS, стр. 46-49. IEEE, (2007)A 120μW 240×110@25fps vision chip with ROI detection SIMD processing unit., , , , , и . ISCAS, стр. 2412-2415. IEEE, (2013)Image Processing Vision Systems: Standard Image Sensors Versus Retinas., , , , , и . IEEE Trans. Instrumentation and Measurement, 56 (5): 1675-1687 (2007)Co-integration of a smart CMOS image sensor and a spatial light modulator for real-time optical phase modulation., , , , , и . IMSE, том 9022 из SPIE Proceedings, стр. 90220N. SPIE, (2014)A near pixel Depth from Focus architecture for video rate depth estimation., , , , и . IMSE, стр. 1-6. Society for Imaging Science and Technology, (2018)Session 21 overview: Innovative personalized biomédical systems: Technology directions subcommittee., и . ISSCC, стр. 378-379. IEEE, (2015)Performance and power analysis on asynchronous reading of binary arrays., , и . ISCAS, IEEE, (2006)