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Influence of substrate thickness on thermal impedance of microelectronic structures., and . Microelectron. Reliab., 47 (2-3): 437-443 (2007)Dynamic thermal modelling of a power integrated circuit with the application of structure functions., , , , , and . Microelectron. J., 40 (7): 1135-1140 (2009)Influence of thermal contact resistance on thermal impedance of microelectronic structures., and . Microelectron. Reliab., 47 (8): 1233-1238 (2007)Thermal impedance plots of micro-scaled devices., and . Microelectron. Reliab., 46 (1): 174-177 (2006)Towards accurate temperature prediction in BEOL for reliability assessment (Invited)., , , , , , , , , and 1 other author(s). IRPS, page 1-7. IEEE, (2023)Dynamic electrothermal simulation of integrated resistors at device level., and . Microelectron. J., 40 (9): 1411-1416 (2009)Impact of 3-D Integration on Thermal Performance of RISC-V MemPool Multicore SOC., , , , , , , , , and . IEEE Trans. Very Large Scale Integr. Syst., 31 (12): 1896-1904 (December 2023)Thermal Performance Analysis of Mempool RISC-V Multicore SoC., , , , , , , , and . IEEE Trans. Very Large Scale Integr. Syst., 30 (11): 1668-1676 (2022)almaBTE : A solver of the space-time dependent Boltzmann transport equation for phonons in structured materials., , , , , , and . Comput. Phys. Commun., (2017)Generation of reduced dynamic thermal models of electronic systems from time constant spectra of transient temperature responses., , , , and . Microelectron. Reliab., 51 (8): 1351-1355 (2011)