Author of the publication

High-Efficiency Time-Division Multiplexing Modulation Technology for Modular Multiactive Bridge Converters.

, , , , , , and . IEEE Trans. Ind. Electron., 71 (6): 5745-5754 (June 2024)

Please choose a person to relate this publication to

To differ between persons with the same name, the academic degree and the title of an important publication will be displayed. You can also use the button next to the name to display some publications already assigned to the person.

 

Other publications of authors with the same name

A Novel Static D-Flip-Flop Topology for Low Swing Clocking., , , , and . ACM Great Lakes Symposium on VLSI, page 301-306. ACM, (2015)Validation of Four Satellite-Derived Soil Moisture Products Using Ground-Based In Situ Observations over Northern China., , , , and . Remote. Sens., 14 (6): 1419 (2022)A Semi-Implicit Parallel Leapfrog Solver With Half-Step Sampling Technique for FPGA-Based Real-Time HIL Simulation of Power Converters., , , , , and . IEEE Trans. Ind. Electron., 71 (3): 2454-2464 (March 2024)Design Methodology for Voltage-Scaled Clock Distribution Networks., , , and . IEEE Trans. Very Large Scale Integr. Syst., 24 (10): 3080-3093 (2016)Real-Time Digital Mapped Method for Sensorless Multitimescale Operation Condition Monitoring of Power Electronics Systems., , , , , and . IEEE Trans. Ind. Electron., 71 (4): 3628-3638 (April 2024)Accurate Time-segmented Loss Model for SiC MOSFETs in Electro-thermal Multi-Rate Simulation., , , , and . CoRR, (2023)FPGA-Based Implicit-Explicit Real-time Simulation Solver for Railway Wireless Power Transfer with Nonlinear Magnetic Coupling Components., , , , , and . CoRR, (2023)Generative Design of XingT, A Human-sized Heavy-duty Bipedal Robot., , , , , and . ROBIO, page 513-518. IEEE, (2022)Low Voltage Clock Tree Synthesis with Local Gate Clusters., , , and . ACM Great Lakes Symposium on VLSI, page 99-104. ACM, (2019)Topology-Aware Matrix Partitioning Method for FPGA Real-Time Simulation of Power Electronics Systems., , , , , , and . IEEE Trans. Ind. Electron., 71 (7): 7158-7168 (2024)