S. Gesper, F. Stuckmann, L. Wöbbekind, and G. Payá-Vayá. Embedded Computer Systems: Architectures, Modeling, and Simulation, page 225--240. Cham, Springer Nature Switzerland, (2023)
M. Beyer, S. Gesper, A. Guntoro, G. Payá-Vayá, and H. Blume. 2023 IEEE 34th International Conference on Application-specific Systems, Architectures and Processors (ASAP), page 61-68. (July 2023)
K. Weide-Zaage, G. Payá-Vayá, K. Schmidt, and D. Hagenah. 2022 23rd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), page 1-5. (April 2022)
M. Weißbrich, and G. Payá-Vayá. Embedded Computer Systems: Architectures, Modeling, and Simulation, page 103--119. Cham, Springer International Publishing, (2022)
M. Weißbrich, H. Blume, and G. Payá-Vayá. 2022 11th International Conference on Modern Circuits and Systems Technologies (MOCAST), page 1-6. (June 2022)
F. Stuckmann, P. Fistanto, and G. Payá-Vayá. 2021 10th International Conference on Modern Circuits and Systems Technologies (MOCAST), page 1-6. (July 2021)
M. Weißbrich, J. Moreno-Medina, and G. Payá-Vayá. 2021 10th International Conference on Modern Circuits and Systems Technologies (MOCAST), page 1-6. (July 2021)