Inproceedings,
Ultrathin wafer handling in 3D Stacked IC manufacturing combining a novel ZoneBOND™ temporary bonding process with room temperature peel debonding.
A. Phommahaxay, A. Jourdain, G. Verbinnen, T. Woitke, P. Bisson, M. Gabriel, W. Spiess, A. Guerrero, J. McCutcheon, R. Puligadda, P. Bex, A. den Eede, B. Swinnen, G. Beyer, A. Miller, and E. Beyne.3DIC, page 1-4. IEEE, (2011)
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- conf/3dic/PhommahaxayJVWBGSGMPBESBMB11
- entry type
- inproceedings
- booktitle
- 3DIC
- year
- 2011
- pages
- 1-4
- publisher
- IEEE
- crossref
- conf/3dic/2011
- ee
- https://doi.org/10.1109/3DIC.2012.6262943
- isbn
- 978-1-4673-2189-1
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- http://dblp.uni-trier.de/db/conf/3dic/3dic2011.html#PhommahaxayJVWBGSGMPBESBMB11
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%1 conf/3dic/PhommahaxayJVWBGSGMPBESBMB11
%A Phommahaxay, Alain
%A Jourdain, Anne
%A Verbinnen, Greet
%A Woitke, Tobias
%A Bisson, Peter
%A Gabriel, Markus
%A Spiess, Walter
%A Guerrero, Alice
%A McCutcheon, Jeremy
%A Puligadda, Rama
%A Bex, Pieter
%A den Eede, Axel Van
%A Swinnen, Bart
%A Beyer, Gerald
%A Miller, Andy
%A Beyne, Eric
%B 3DIC
%D 2011
%E Koyanagi, Mitsumasa
%E Kada, Morihiro
%I IEEE
%K dblp
%P 1-4
%T Ultrathin wafer handling in 3D Stacked IC manufacturing combining a novel ZoneBOND™ temporary bonding process with room temperature peel debonding.
%U http://dblp.uni-trier.de/db/conf/3dic/3dic2011.html#PhommahaxayJVWBGSGMPBESBMB11
%@ 978-1-4673-2189-1
@inproceedings{conf/3dic/PhommahaxayJVWBGSGMPBESBMB11,
added-at = {2021-10-14T00:00:00.000+0200},
author = {Phommahaxay, Alain and Jourdain, Anne and Verbinnen, Greet and Woitke, Tobias and Bisson, Peter and Gabriel, Markus and Spiess, Walter and Guerrero, Alice and McCutcheon, Jeremy and Puligadda, Rama and Bex, Pieter and den Eede, Axel Van and Swinnen, Bart and Beyer, Gerald and Miller, Andy and Beyne, Eric},
biburl = {https://www.bibsonomy.org/bibtex/2c12d600342f607943c4c41c1f43b20a8/dblp},
booktitle = {3DIC},
crossref = {conf/3dic/2011},
editor = {Koyanagi, Mitsumasa and Kada, Morihiro},
ee = {https://doi.org/10.1109/3DIC.2012.6262943},
interhash = {42f94045a391933b21c62e834758acc4},
intrahash = {c12d600342f607943c4c41c1f43b20a8},
isbn = {978-1-4673-2189-1},
keywords = {dblp},
pages = {1-4},
publisher = {IEEE},
timestamp = {2024-04-10T12:11:22.000+0200},
title = {Ultrathin wafer handling in 3D Stacked IC manufacturing combining a novel ZoneBOND™ temporary bonding process with room temperature peel debonding.},
url = {http://dblp.uni-trier.de/db/conf/3dic/3dic2011.html#PhommahaxayJVWBGSGMPBESBMB11},
year = 2011
}