Author of the publication

Low noise MCML prefix adders using 0.18 µm CMOS technology.

, and . Circuits, Signals, and Systems, page 467-470. IASTED/ACTA Press, (2004)

Please choose a person to relate this publication to

To differ between persons with the same name, the academic degree and the title of an important publication will be displayed. You can also use the button next to the name to display some publications already assigned to the person.

 

Other publications of authors with the same name

Design Considerations and Performance Trade-Offs for 56Gb/s Discrete Multi-Tone Electrical Link., , , , and . MWSCAS, page 1147-1150. IEEE, (2019)Programmable active pixel sensor for low-light biomedical applications., , , and . BioCAS, page 655-658. IEEE, (2014)A current sensing completion detection method for asynchronous pipelines operating in the sub-threshold regime., , and . I. J. Circuit Theory and Applications, 37 (2): 203-220 (2009)Copper TSV-based die-level via-last 3D integration process with parylene-C adhesive bonding technique., , and . 3DIC, page 1-5. IEEE, (2016)A stochastic perturbative approach to design a defect-aware thresholder in the sense amplifier of crossbar memories., , , and . ASP-DAC, page 835-840. IEEE, (2009)Self-Calibrated Delay-Based LSB Extraction for Resolution Improvement in SAR ADCs., , and . NORCAS, page 1-7. IEEE, (2019)Full swing 20 GHz frequency divider with 1 V supply voltage in FD-SOI 28 nm technology., , , and . NORCAS, page 1-4. IEEE, (2015)Design and Testing Strategies for Modular 3-D-Multiprocessor Systems Using Die-Level Through Silicon Via Technology., , , , , , and . IEEE J. Emerg. Sel. Topics Circuits Syst., 2 (2): 295-306 (2012)Integrating bio-sensing functions on CMOS chips., , , , , , and . APCCAS, page 548-551. IEEE, (2010)Load Optimization of an Inductive Power Link for Remote Powering of Biomedical Implants., , , , , , and . ISCAS, page 533-536. IEEE, (2009)