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Disambiguation of "Takeda, Kenichi"

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Chip-level TSV integration for rapid prototyping of 3D system LSIs.

, , , , , , , , and . 3DIC, page 1-4. IEEE, (2011)

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Genichiro Takeda

Kenichi Ishikawa

Michiko Takeda

Kijuro Takeda

Kenichi Kida

 

Other publications of authors with the same name

Void reduction in wafer bonding by simultaneously formed ventilation channels., , and . 3DIC, page 1-5. IEEE, (2011)Wafer-level hybrid bonding technology with copper/polymer co-planarization., , and . 3DIC, page 1-4. IEEE, (2010)TinyCowNet: Memory- and Power-Minimized RNNs Implementable on Tiny Edge Devices for Lifelong Cow Behavior Distribution Estimation., , , , , , , , , and . IEEE Access, (2022)Chip-level TSV integration for rapid prototyping of 3D system LSIs., , , , , , , , and . 3DIC, page 1-4. IEEE, (2011)Reducing IR drop in 3D integration to less than 1/4 using Buck Converter on Top die (BCT) scheme., , , , , , , and . ISQED, page 210-215. IEEE, (2013)A Data Augmentation Method for Cow Behavior Estimation Systems Using 3-Axis Acceleration Data and Neural Network Technology., , , , , , , , and . IEICE Trans. Fundam. Electron. Commun. Comput. Sci., 105-A (4): 655-663 (2022)Accuracy of computer-aided diagnosis based on narrow-band imaging endocytoscopy for diagnosing colorectal lesions: comparison with experts., , , , , , , , , and 7 other author(s). Int. J. Comput. Assist. Radiol. Surg., 12 (5): 757-766 (2017)A 216 μW, 87% Accurate Cow Behavior Classifying Decision Tree on FPGA with Interpolated Arctan2., , , , , , , and . ISCAS, page 1-5. IEEE, (2021)