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STT-Based Non-Volatile Logic-in-Memory Framework., , и . Field-Coupled Nanocomputing, том 8280 из Lecture Notes in Computer Science, Springer, (2014)Design tool and methodologies for interconnect reliability analysis in integrated circuits.. Massachusetts Institute of Technology, Cambridge, MA, USA, (2004)ndltd.org (oai:dspace.mit.edu:1721.1/26722).Power Delivery Design for 3-D ICs Using Different Through-Silicon Via (TSV) Technologies., , и . IEEE Trans. Very Large Scale Integr. Syst., 19 (4): 647-658 (2011)Circuit Level Reliability Analysis of Cu Interconnects., , , и . ISQED, стр. 238-243. IEEE Computer Society, (2004)A 180 Kbit Embeddable MRAM Memory Module., , , , , , , и . IEEE J. Solid State Circuits, 43 (8): 1826-1834 (2008)Low Power Magnetic Quantum Cellular Automata Realization Using Magnetic Multi-Layer Structures., , и . IEEE J. Emerg. Sel. Topics Circuits Syst., 1 (3): 267-276 (2011)Technology, CAD tools, and designs for emerging 3D integration technology., , и . ACM Great Lakes Symposium on VLSI, стр. 1-2. ACM, (2008)Reliability computer-aided design tool for full-chip electromigration analysis and comparison with different interconnect metallizations., , , и . Microelectron. J., 38 (4-5): 463-473 (2007)A Comprehensive Layout Methodology and Layout-Specific Circuit Analyses for Three-Dimensional Integrated Circuits., , и . ISQED, стр. 246-251. IEEE Computer Society, (2002)A 180 Kbit Embeddable MRAM Memory Module., , , , , , и . CICC, стр. 791-794. IEEE, (2007)