( en | de | ru )

 

Disambiguation of "Vermeersch, Bjorn"

Author of the publication

copydeleteadd this publication to your clipboard
Self-Heating in iN8-iN2 CMOS Logic Cells: Thermal Impact of Architecture (FinFET, Nanosheet, Forksheet and CFET) and Scaling Boosters.

, , , , , , and . VLSI Technology and Circuits, page 371-372. IEEE, (2022)

Please choose a person to relate this publication to

To differ between persons with the same name, the academic degree and the title of an important publication will be displayed. You can also use the button next to the name to display some publications already assigned to the person.

Saskia Björn

Bolli Björnsson

Gerhild Bjornson

Ulf Björner

Anders Jørgen Bjørndalen

 

Other publications of authors with the same name

Influence of substrate thickness on thermal impedance of microelectronic structures., and . Microelectron. Reliab., 47 (2-3): 437-443 (2007)Thermal impedance plots of micro-scaled devices., and . Microelectron. Reliab., 46 (1): 174-177 (2006)Influence of thermal contact resistance on thermal impedance of microelectronic structures., and . Microelectron. Reliab., 47 (8): 1233-1238 (2007)Dynamic thermal modelling of a power integrated circuit with the application of structure functions., , , , , and . Microelectron. J., 40 (7): 1135-1140 (2009)Towards accurate temperature prediction in BEOL for reliability assessment (Invited)., , , , , , , , , and 1 other author(s). IRPS, page 1-7. IEEE, (2023)Dynamic electrothermal simulation of integrated resistors at device level., and . Microelectron. J., 40 (9): 1411-1416 (2009)Impact of 3-D Integration on Thermal Performance of RISC-V MemPool Multicore SOC., , , , , , , , , and . IEEE Trans. Very Large Scale Integr. Syst., 31 (12): 1896-1904 (December 2023)Thermal Performance Analysis of Mempool RISC-V Multicore SoC., , , , , , , , and . IEEE Trans. Very Large Scale Integr. Syst., 30 (11): 1668-1676 (2022)Generation of reduced dynamic thermal models of electronic systems from time constant spectra of transient temperature responses., , , , and . Microelectron. Reliab., 51 (8): 1351-1355 (2011)Dependency of thermal spreading resistance on convective heat transfer coefficient., and . Microelectron. Reliab., 48 (5): 734-738 (2008)