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Design Issues and Considerations for Low-Cost 3-D TSV IC Technology., , , , , , , , , and 27 other author(s). IEEE J. Solid State Circuits, 46 (1): 293-307 (2011)Four-point bending cycling: The alternative for thermal cycling solder fatigue testing of electronic components., , , , , , , , , and . Microelectron. Reliab., (2017)Diffusion growth of Cu3Sn phase in the bump and thin film Cu/Sn structures., , , , , , and . Microelectron. Reliab., 52 (9-10): 1971-1974 (2012)Cu pumping in TSVs: Effect of pre-CMP thermal budget., , , , , , , , , and . Microelectron. Reliab., 51 (9-11): 1856-1859 (2011)Design issues and considerations for low-cost 3D TSV IC technology., , , , , , , , , and 24 other author(s). ISSCC, page 148-149. IEEE, (2010)Processing assessment and adhesion evaluation of copper through-silicon vias (TSVs) for three-dimensional stacked-integrated circuit (3D-SIC) architectures., , , , , , , , and . Microelectron. Reliab., 50 (9-11): 1636-1640 (2010)