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Disambiguation of "Vandevelde, Bart"

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Four-point bending cycling: The alternative for thermal cycling solder fatigue testing of electronic components.

, , , , , , , , , and . Microelectron. Reliab., (2017)

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Bart Cramer

Bart Maris

Bart Kersbergen

Bart Riel

Bart Geurts

 

Other publications of authors with the same name

Modeling and Control of Electrowetting Induced Droplet Motion., , and . Micromachines, 3 (1): 150-167 (2012)Design Issues and Considerations for Low-Cost 3-D TSV IC Technology., , , , , , , , , and 27 other author(s). IEEE J. Solid State Circuits, 46 (1): 293-307 (2011)3D chip package interaction thermo-mechanical challenges: Proximity effects of Through Silicon vias and μ-bumps., , , , , , , , , and 9 other author(s). ICICDT, page 1-4. IEEE, (2012)Convection heat transfer in electrostatic actuated liquid droplets for electronics cooling., , , , and . Microelectron. J., 39 (7): 966-974 (2008)Comparison of experimental methods for the extraction of the elastic modulus of molding compounds used in IC packaging., , , , , , and . Microelectron. Reliab., 52 (11): 2677-2684 (2012)Design and implementation of flexible and stretchable systems., , , , , , , , and . Microelectron. Reliab., 51 (6): 1069-1076 (2011)Improved and accurate physics-of-failure (PoF) methodology for qualification and lifetime assessment of electronic systems., , , , , and . Microelectron. Reliab., (2017)MEMS packaging and reliability: An undividable couple., , , , , , , , , and 1 other author(s). Microelectron. Reliab., 52 (9-10): 2228-2234 (2012)Design of metal interconnects for stretchable electronic circuits., , , , , and . Microelectron. Reliab., 48 (6): 825-832 (2008)Package and solder joint reliability analysed by FEM simulation and experiments., and . Microelectron. Reliab., 44 (12): 1891-1892 (2004)