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Transceiver circuits for pulse-based ultra-wideband., , , and . ISCAS (4), page 349-352. IEEE, (2004)Low-latency wireless 3D NoCs via randomized shortcut chips., , , , , , , , and . DATE, page 1-6. European Design and Automation Association, (2014)3D clock distribution using vertically/horizontally-coupled resonators., , , and . ISSCC, page 258-259. IEEE, (2013)A 0.15mm-thick non-contact connector for MIPI using vertical directional coupler., , , , , , , and . ISSCC, page 200-201. IEEE, (2013)1W 3.3V-to-16.3V boosting wireless power transfer circuits with vector summing power controller., , , and . A-SSCC, page 177-180. IEEE, (2011)Wireless power transfer to stacked modules for IoT sensor nodes., , , , and . ISOCC, page 59-60. IEEE, (2017)A 4-Gbps Quasi-Millimeter-Wave Transmitter in 65 nm CMOS and a Fast Carrier and Symbol Timing Recovery Scheme., , and . IEICE Trans. Electron., 93-C (1): 120-127 (2010)A 1.2 Gbps Non-contact 3D-Stacked Inter-Chip Data Communications Technology., , , and . IEICE Trans. Electron., 89-C (3): 320-326 (2006)A Dynamic Offset Control Technique for Comparator Design in Scaled CMOS Technology., , , , , , , and . IEICE Trans. Fundam. Electron. Commun. Comput. Sci., 93-A (12): 2456-2462 (2010)Constant Magnetic Field Scaling in Inductive-Coupling Data Link., , , and . IEICE Trans. Electron., 91-C (2): 200-205 (2008)