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Insights into metal drift induced failure in MOL and BEOL.

C. Wu, O. Pedreira, A. Lesniewska, Y. Li, I. Ciofi, Z. Tökei, and K. Croes. IRPS, page 3. IEEE, (2018)

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Zsolt Szücs

Zsolt Szabó

Zsolt Zrinyi

Zsolt Szabó

Zsolt Szentiványi

Other publications of authors with the same name

Layout dependency induced deviation from Poisson area scaling in BEOL dielectric reliability.Y. Li, Z. Tökei, P. Roussel, G. Groeseneken, and K. Maex. Microelectron. Reliab., 45 (9-11): 1299-1304 (2005)As-grown donor-like traps in low-k dielectrics and their impact on intrinsic TDDB reliability.B. Tang, K. Croes, Y. Barbarin, Y. Wang, R. Degraeve, Y. Li, M. Toledano-Luque, T. Kauerauf, J. Bömmels, Z. Tökei and 1 other author(s). Microelectron. Reliab., 54 (9-10): 1675-1679 (2014)Low-Frequency Noise Measurements to Characterize Cu-Electromigration Down to 44nm Metal Pitch.S. Beyne, O. Pedreira, I. Wolf, Z. Tökei, and K. Croes. IRPS, page 1-6. IEEE, (2019)Stress mitigation of 3D-stacking/packaging induced stresses.K. Croes, V. Cherman, M. Lofrano, H. Zahedmanesh, L. Kljucar, M. Gonzalez, I. Wolf, Z. Tökei, and E. Beyne. IRPS, page 4. IEEE, (2018)Metal reliability mechanisms in Ruthenium interconnects.O. Pedreira, M. Stucchi, A. Gupta, V. Vega-Gonzalez, M. van der Veen, S. Lariviere, C. Wilson, Z. Tökei, and K. Croes. IRPS, page 1-7. IEEE, (2020)Evaluation of via density and low-k Young's modulus influence on mechanical performance of advanced node multi-level Back-End-Of-Line.L. Kljucar, M. Gonzalez, I. Wolf, K. Croes, J. Bömmels, and Z. Tökei. Microelectron. Reliab., (2016)Impact of via density and passivation thickness on the mechanical integrity of advanced Back-End-Of-Line interconnects.L. Kljucar, M. Gonzalez, K. Croes, I. Wolf, J. Messemaeker, G. Murdoch, P. Nolmans, J. Vos, J. Bömmels, E. Beyne and 1 other author(s). Microelectron. Reliab., (2017)Reliability of a DME Ru Semidamascene scheme with 16 nm wide Airgaps.A. Lesniewska, O. Pedreira, M. Lofrano, G. Murdoch, M. van der Veen, A. Dangol, N. Horiguchi, Z. Tökei, and K. Croes. IRPS, page 1-6. IEEE, (2021)Dielectric Reliability Study of 21 nm Pitch Interconnects with Barrierless Ru Fill.A. Lesniewska, P. Roussel, D. Tierno, V. Vega-Gonzalez, M. van der Veen, P. Verdonck, N. Jourdan, C. Wilson, Z. Tökei, and K. Croes. IRPS, page 1-6. IEEE, (2020)Insights into metal drift induced failure in MOL and BEOL.C. Wu, O. Pedreira, A. Lesniewska, Y. Li, I. Ciofi, Z. Tökei, and K. Croes. IRPS, page 3. IEEE, (2018)

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Insights into metal drift induced failure in MOL and BEOL.

Please choose a person to relate this publication to

Zsolt Szücs

Zsolt Szabó

Zsolt Zrinyi

Zsolt Szabó

Zsolt Szentiványi

Other publications of authors with the same name

Disambiguation

BibSonomy

Disambiguation of "Tökei, Zsolt"

copydeleteadd this publication to your clipboardcommunity posthistory of this postURLDOIBibTeXEndNoteAPAChicagoDIN 1505HarvardMSOffice XML Insights into metal drift induced failure in MOL and BEOL.

Please choose a person to relate this publication to

Zsolt Szücs

Zsolt Szabó

Zsolt Zrinyi

Zsolt Szabó

Zsolt Szentiványi

Other publications of authors with the same name

Disambiguation

copy delete add this publication to your clipboard
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history of this post
URL
DOI
BibTeX
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APA
Chicago
DIN 1505
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Insights into metal drift induced failure in MOL and BEOL.