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Reliability of a DME Ru Semidamascene scheme with 16 nm wide Airgaps.

A. Lesniewska, O. Pedreira, M. Lofrano, G. Murdoch, M. van der Veen, A. Dangol, N. Horiguchi, Z. Tökei, and K. Croes. IRPS, page 1-6. IEEE, (2021)

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Alicja Niedworok

Alicja Bukowska

Alicja Dolzblasz

Alicja Ossowska

Alicja Ditschek

Other publications of authors with the same name

Role of Defects in the Reliability of HfO2/Si-Based Spacer Dielectric Stacks for Local Interconnects.C. Wu, A. Chasin, A. Padovani, A. Lesniewska, S. Demuynck, and K. Croes. IRPS, page 1-6. IEEE, (2019)First demonstration of Two Metal Level Semi-damascene Interconnects with Fully Self-aligned Vias at 18MP.G. Murdoch, M. O'Toole, G. Marti, A. Pokhrel, D. Tsvetanova, S. Decoster, S. Kundu, Y. Oniki, A. Thiam, Q. Le and 5 other author(s). VLSI Technology and Circuits, page 1-2. IEEE, (2022)Towards accurate temperature prediction in BEOL for reliability assessment (Invited).M. Lofrano, H. Oprins, X. Chang, B. Vermeersch, O. Pedreira, A. Lesniewska, V. Cherman, I. Ciofi, K. Croes, S. Park and 1 other author(s). IRPS, page 1-7. IEEE, (2023)Silicon Photonics for 56G NRZ Optical Interconnects.J. Campenhout, Y. Ban, P. Heyn, A. Srinivasan, J. Coster, S. Lardenois, B. Snyder, S. Balakrishnan, G. Lepage, N. Golshani and 7 other author(s). OFC, page 1-3. IEEE, (2018)Intrinsic reliability of local interconnects for N7 and beyond.K. Croes, A. Lesniewska, C. Wu, I. Ciofi, A. Banczerowska, B. Briggs, S. Demuynck, Z. Tökei, J. Bömmels, Y. Saad and 1 other author(s). IRPS, page 2. IEEE, (2015)Reliability of a DME Ru Semidamascene scheme with 16 nm wide Airgaps.A. Lesniewska, O. Pedreira, M. Lofrano, G. Murdoch, M. van der Veen, A. Dangol, N. Horiguchi, Z. Tökei, and K. Croes. IRPS, page 1-6. IEEE, (2021)Dielectric Reliability Study of 21 nm Pitch Interconnects with Barrierless Ru Fill.A. Lesniewska, P. Roussel, D. Tierno, V. Vega-Gonzalez, M. van der Veen, P. Verdonck, N. Jourdan, C. Wilson, Z. Tökei, and K. Croes. IRPS, page 1-6. IEEE, (2020)Insights into metal drift induced failure in MOL and BEOL.C. Wu, O. Pedreira, A. Lesniewska, Y. Li, I. Ciofi, Z. Tökei, and K. Croes. IRPS, page 3. IEEE, (2018)BEOL tip-to-tip dielectric reliability characterization using a design-representative test structure.Y. Fang, A. Lesniewska, I. Ciofi, P. Roussel, C. Wu, V. Vega-Gonzalez, I. Wolf, and K. Croes. IRPS, page 1-7. IEEE, (2024)Method to assess the impact of LER and spacing variation on BEOL dielectric reliability using 2D-field simulations for <20nm spacing.D. Kocaay, P. Roussel, K. Croes, I. Ciofi, A. Lesniewska, and I. Wolf. IRPS, page 10-1. IEEE, (2018)

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Disambiguation of "Lesniewska, Alicja"

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Reliability of a DME Ru Semidamascene scheme with 16 nm wide Airgaps.

Please choose a person to relate this publication to

Alicja Niedworok

Alicja Bukowska

Alicja Dolzblasz

Alicja Ossowska

Alicja Ditschek

Other publications of authors with the same name

Disambiguation

BibSonomy

Disambiguation of "Lesniewska, Alicja"

copydeleteadd this publication to your clipboardcommunity posthistory of this postURLDOIBibTeXEndNoteAPAChicagoDIN 1505HarvardMSOffice XML Reliability of a DME Ru Semidamascene scheme with 16 nm wide Airgaps.

Please choose a person to relate this publication to

Alicja Niedworok

Alicja Bukowska

Alicja Dolzblasz

Alicja Ossowska

Alicja Ditschek

Other publications of authors with the same name

Disambiguation

copy delete add this publication to your clipboard
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history of this post
URL
DOI
BibTeX
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APA
Chicago
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Reliability of a DME Ru Semidamascene scheme with 16 nm wide Airgaps.