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Disambiguation of "Salman, Emre"

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Package-embedded spiral inductor characterization with application to switching buck converters.

, , and . Microelectron. J., (2017)

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Emre Türkeli

Retrospektive Analyse der Amnionmembrantransplantation zur Behandlung entzündlicher Erkrankungen der Augenoberfläche. Uni Duisburg-Essen, (2009)

Abdullah Salman Salman

Salman Abdullah Salman

Ahmet Cevat Emre

Ali Haydar Emre

 

Other publications of authors with the same name

Noise coupling due to through silicon vias (TSVs) in 3-D integrated circuits.. ISCAS, page 1411-1414. IEEE, (2011)Design space exploration for robust power delivery in TSV based 3-D systems-on-chip., and . SoCC, page 307-311. IEEE, (2012)FinFET-Based Low-Swing Clocking., , , , and . JETC, 12 (2): 13:1-13:20 (2015)Impact of Power Distribution Network on Power Analysis Attacks in Three-Dimensional Integrated Circuits., , , , and . ACM Great Lakes Symposium on VLSI, page 327-332. ACM, (2017)Shielding Methodologies in the Presence of Power/Ground Noise., , and . ISCAS, page 2277-2280. IEEE, (2009)Hardware-Efficient Logic Camouflaging for Monolithic 3-D ICs., , , , and . IEEE Trans. Circuits Syst. II Express Briefs, 65-II (6): 799-803 (2018)Perspective Paper - Can AC Computing Be an Alternative for Wirelessly Powered IoT Devices?, , , and . IEEE Embed. Syst. Lett., 9 (1): 13-16 (2017)Power Distribution in TSV-Based 3-D Processor-Memory Stacks., and . IEEE J. Emerg. Sel. Topics Circuits Syst., 2 (4): 692-703 (2012)Signal Shaping at Interface of Wireless Power Harvesting and AC Computational Logic., , , and . ISCAS, page 1-5. IEEE, (2019)Effect of TSV fabrication technology on power distribution in 3D ICs., and . ACM Great Lakes Symposium on VLSI, page 287-292. ACM, (2013)