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Disambiguation of "Kino, Hisashi"

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Wide-range and precise tissue impedance analysis circuit with ultralow current source using gate-induced drain-leakage current.

, , , , , , , , and . BioCAS, page 304-307. IEEE, (2016)

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Hisashi Saeki

Hisashi Ochi

Asako Kinoshita

Asako Kinoshita

Hisashi Sugiura

 

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Implementation of Light and Dark Adaptation Function for High QOL 3D-Stacked Artificial Retina Chip., , , , , , , , , and . BioCAS, page 519-523. IEEE, (2022)3D-stacked retinal prosthesis chip with binary image capture and edge detection functions for human visual restoration., , , , , , , , , and . IEICE Electron. Express, 19 (23): 20220363 (2022)Multiple optical stimulation to neuron using Si opto-neural probe with multiple optical waveguides and metal-cover for optogenetics., , , , , , , and . EMBC, page 253-256. IEEE, (2013)Oxide-Oxide Thermocompression Direct Bonding Technologies with Capillary Self-Assembly for Multichip-to-Wafer Heterogeneous 3D System Integration., , , , , , , , and . Micromachines, 7 (10): 184 (2016)Impact of Super-long-throw PVD on TSV Metallization and Die-to-Wafer 3D Integration Based on Via-last., , , , , , , , and . 3DIC, page 1-4. IEEE, (2023)Consideration of microbump layout for reduction of local bending stress due to CTE Mismatch in 3D IC., , , , , , , and . 3DIC, page TS8.26.1-TS8.26.4. IEEE, (2015)Micro-Raman spectroscopy analysis and capacitance - time (C-t) measurement of thinned silicon substrates for 3D integration., , , , , , , , and . 3DIC, page 1-5. IEEE, (2009)Investigation of the Underfill with Negative-Thermal-Expansion Material to Suppress Mechanical Stress in 3D Integration System., , and . 3DIC, page 1-4. IEEE, (2019)Impacts of Deposition Temperature and Annealing Condition on Ozone-Ethylene Radical Generation-TEOS-CVD SiO2 for Low-Temperature TSV Liner Formation., , , , , , , and . 3DIC, page 1-4. IEEE, (2019)Development of a CDS Circuit for 3-D Stacked Neural Network Chip using CMOS Analog Signal Processing., , , , , and . 3DIC, page 1-4. IEEE, (2019)