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3D-STAF: scalable temperature and leakage aware floorplanning for three-dimensional integrated circuits.

P. Zhou, Y. Ma, Z. Li, R. Dick, L. Shang, H. Zhou, X. Hong, and Q. Zhou. ICCAD, page 590-597. IEEE Computer Society, (2007)

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Yuchun Li

Yuchun Ding

Yuzhao Ma

Characterization of higher order modes in optical fibersY. Ma. Uni Erlangen-Nürnberg, (2009)

Tsie Ma

Lan Ma

Other publications of authors with the same name

LP based white space redistribution for thermal via planning and performance optimization in 3D ICs.X. Li, Y. Ma, X. Hong, S. Dong, and J. Cong. ASP-DAC, page 209-212. IEEE, (2008)Rethinking thermal via planning with timing-power-temperature dependence for 3D ICs.K. Wang, Y. Ma, S. Dong, Y. Wang, X. Hong, and J. Cong. ASP-DAC, page 261-266. IEEE, (2011)VLSI floorplanning with boundary constraints based on corner block list.Y. Ma, S. Dong, X. Hong, Y. Cai, C. Cheng, and J. Gu. ASP-DAC, page 509-514. ACM, (2001)Automatic enhanced CDFG generation based on runtime instrumentation.Z. Yuan, Y. Ma, J. Bian, and K. Zhao. CSCWD, page 92-97. IEEE, (2013)Thermal-aware P/G TSV planning for IR drop reduction in 3D ICs.Z. Li, Y. Ma, Q. Zhou, Y. Cai, Y. Xie, and T. Huang. Integr., 46 (1): 1-9 (2013)Variation-Aware Supply Voltage Assignment for Simultaneous Power and Aging Optimization.X. Chen, Y. Wang, Y. Cao, Y. Ma, and H. Yang. IEEE Trans. Very Large Scale Integr. Syst., 20 (11): 2143-2147 (2012)A buffer planning algorithm for chip-level floorplanning.S. Chen, X. Hong, S. Dong, Y. Ma, Y. Cai, C. Cheng, and J. Gu. Sci. China Ser. F Inf. Sci., 47 (6): 763-776 (2004)Corner block list representation and its application with boundary constraints.X. Hong, Y. Ma, S. Dong, Y. Cai, C. Cheng, and J. Gu. Sci. China Ser. F Inf. Sci., 47 (1): 1-19 (2004)An integrated floorplanning with an efficient buffer planning algorithm.Y. Ma, X. Hong, S. Dong, S. Chen, Y. Cai, C. Cheng, and J. Gu. ISPD, page 136-142. ACM, (2003)Novel and efficient min cut based voltage assignment in gate level.T. Lin, S. Dong, S. Chen, Y. Ma, O. He, and S. Goto. ISQED, page 150-155. IEEE, (2011)

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Disambiguation of "Ma, Yuchun"

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3D-STAF: scalable temperature and leakage aware floorplanning for three-dimensional integrated circuits.

Please choose a person to relate this publication to

Yuchun Li

Yuchun Ding

Yuzhao Ma

Tsie Ma

Lan Ma

Other publications of authors with the same name

Disambiguation

BibSonomy

Disambiguation of "Ma, Yuchun"

copydeleteadd this publication to your clipboardcommunity posthistory of this postURLDOIBibTeXEndNoteAPAChicagoDIN 1505HarvardMSOffice XML 3D-STAF: scalable temperature and leakage aware floorplanning for three-dimensional integrated circuits.

Please choose a person to relate this publication to

Yuchun Li

Yuchun Ding

Yuzhao Ma

Tsie Ma

Lan Ma

Other publications of authors with the same name

Disambiguation

copy delete add this publication to your clipboard
community post
history of this post
URL
DOI
BibTeX
EndNote
APA
Chicago
DIN 1505
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MSOffice XML

3D-STAF: scalable temperature and leakage aware floorplanning for three-dimensional integrated circuits.